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參數資料
| 型號： | 5962R9863601VGX |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | 運算放大器 |
| 英文描述： | OP-AMP, 2500 uV OFFSET-MAX, MBCY8 |
| 封裝： | METAL CAN-8 |
| 文件頁數： | 4/13頁 |
| 文件大小： | 76K |
| 代理商： | 5962R9863601VGX |
STANDARD
MICROCIRCUIT DRAWING
SIZE
A
5962-98636
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
A
SHEET
12
DSCC FORM 2234
APR 97
4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein.
4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured
(see 3.5 herein). RHA levels for device classes M, Q, and V shall be as specified in MIL-I-38535. End-point electrical parameters
shall be as specified in table IIA herein.
4.4.4.1 Total dose irradiation testing. Total dose irradiation testing shall be performed in accordance with MIL-STD-883 method
1019 and as specified herein.
4.4.4.1.1 Accelerated aging test. Accelerated aging tests shall be performed on all devices requiring a RHA level greater than 5k
rads(Si). The post-anneal end-point electrical parameter limits shall be as specified in table I herein and shall be the pre-irradiation
end-point electrical parameter limit at 25
°C ±5°C. Testing shall be performed at initial qualification and after any design or process
changes which may affect the RHA response of the device.
4.4.4.2 Dose rate burnout. When required by the customer test shall be performed on devices, SEC, or approved test structures
at technology qualifications and after any design or process changes which may effect the RHA capability of the process. Dose rate
burnout shall be performed in accordance with test method 1023 of MIL-STD-883 and as specified herein.
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q
and V or MIL-PRF-38535, appendix A for device class M.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original
equipment), design applications, and logistics purposes.
6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractor prepared
specification or drawing.
6.1.2 Substitutability. Device class Q devices will replace device class M devices.
6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the
individual documents. This coordination will be accomplished in accordance with MIL-STD-973 using DD Form 1692, Engineering
Change Proposal.
6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus when a system application
requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users and this list will
be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC
5962) should contact DSCC-VA, telephone (614) 692-0525.
6.4 Comments. Comments on this drawing should be directed to DSCC-VA , Columbus, Ohio 43216-5000, or telephone
(614) 692-0674.
6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in
MIL-PRF-38535 and MIL-HDBK-1331.
6.6 Sources of supply.
6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The
vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to this
drawing.
6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103. The
vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to
and accepted by DSCC-VA.
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