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參數(shù)資料
| 型號： | 599-10-560-20-007429 |
| 廠商： | MILL-MAX MFG CORP |
| 元件分類： | 插座 |
| 英文描述： | BGA560, IC SOCKET |
| 封裝： | ROHS COMPLIANT |
| 文件頁數(shù)： | 1/2頁 |
| 文件大小： | 69K |
| 代理商： | 599-10-560-20-007429 |
Product Number: 599-10-560-20-007429
560-20-007
39 X 39
Description:
BGA Header
1mm Grid; BGA Header
Plating Code:
10
Shell Plating:
10
" Gold over 100
" Nickel
#
Of
Pins
Mill-Max
Part
Number
RoHS
Compliant
560
599-10-560-20-007429
LOOSE PIN:
Loose Pin Used: 9929
BRASS ALLOY (UNS C36000) per ASTM B 16
Properties of BRASS ALLOY:
Chemical composition: Cu 61.5%, Zn 35.4%, Pb 3.1%
Hardness as machined: 80-90 Rockwell B
Density: .307 lbs/in3
Electrical conductivity: 26% IACS*
Melting point: 900°C/885°C (liquidus/solidus)
(3 to 4% lead is used to permit “free machining” and is permitted by EC Directive 2002/95Annex 6; so all pin materials are
RoHS compliant)
*International Annealed Copper Standard, i.e. as a % of pure copper.
INSULATOR INFORMATION:
FR-4 Laminate
High Temperature
Properties of FR-4 Laminate:
Epoxy/Glass Laminate. Thicknesses available: .010”, .020”, .031”, .047”, .062”, .093”, .125” (natural color, beige)
Page 1 of 2
Mill-Max Mfg. Corp. Datasheet – Last Modified 6/27/2008
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