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參數資料
| 型號： | 599-11-560-20-007428 |
| 廠商： | MILL-MAX MFG CORP |
| 元件分類： | 插座 |
| 英文描述： | BGA560, IC SOCKET |
| 封裝： | ROHS COMPLIANT |
| 文件頁數： | 1/2頁 |
| 文件大小： | 86K |
| 代理商： | 599-11-560-20-007428 |
Product Number: 599-11-560-20-007428
560-20-007
39 X 39
Description:
BGA Socket
1mm Grid; BGA Socket
Surface Mount
Accepts .008-.013" Leads
Plating Code:
11
Shell Plating:
10
" Gold over 100
" Nickel
Inner Contact Plating:
10
" Gold over 50
" Nickel
#
Of
Pins
Mill-Max
Part
Number
RoHS
Compliant
560
599-11-560-20-007428
CONTACT:
Contact Used: #04, Standard 3 Finger Contact
Current Rating = 2 Amps
BERYLLIUM COPPER ALLOY 172 (UNS C17200) per
ASTM B 194
Properties of BERYLLIUM COPPER:
Chemical composition: Cu 98.1%, Be 1.9%
Temper as stamped: TD01
Properties after heat treatment (TH01):
Hardness: 36-43 Rockwell C
Mechanical Life: 100 Cycles Min.
Density: .298 lbs/in3
Electrical Conductivity: 22% IACS*
Resistance: 10 miliohms Max
Operating Temperature: -55°C/+125°C
Melting point: 980°C/865°C (liquidus/solidus)
Stress Relaxation: 96% of stress remains after 1,000 hours @ 100 C ; 70% of stress remains after 1,000 hours @ 200
C
*International Annealed Copper Standard, i.e. as a % of pure copper.
Since BeCu loses its spring properties over time at high temperatures; it is rated for continuous use up to 150°C. For
applications up to 300°C, Mill-Max offers many contacts in Beryllium Nickel. Contact Tech Support for more info.
Page 1 of 2
Mill-Max Mfg. Corp. Datasheet – Last Modified 6/27/2008
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