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參數(shù)資料
| 型號： | 6-1437531-9 |
| 元件分類： | 插座 |
| 英文描述： | DIP18, IC SOCKET |
| 文件頁數(shù)： | 1/3頁 |
| 文件大小： | 208K |
| 代理商： | 6-1437531-9 |
Sockets
DIP Sockets
518-AG11D
(Tyco Electronics P/N: 6-1437531-9)
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Searchable Features:
Brand:
AMP
RoHS/ELV Compliance:
Non-compliant
Lead Free Solder
Process:
Reflow solder
capable to 245°C
Product Type:
DIP Socket
No. of Positions:
18
Row-to-Row Spacing
(mm [in]):
7.62 [0.300]
Contact Mount:
Thru Hole
Mount Style:
Vertical
Centerline (mm [in]):
2.54 [0.100]
Profile:
Standard
Frame Style:
Closed
Leg Style:
Straight
Contact Material:
Beryllium Copper
Other Properties:
Insulation Resistance
(MΩ):
5,000
Contact Resistance
(mO):
10
Sleeve Material:
Brass/Copper
Contact Termination
Area Plating:
Tin-Lead
Product Series:
500 Series
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PDF描述 |
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| 6-1437532-1 | DIP32, IC SOCKET |
| 6-1437532-5 | DIP32, IC SOCKET |
| 6-1437535-0 | SIP6, IC SOCKET |
| 6-1437535-1 | SIP7, IC SOCKET |
| 6-1437535-2 | SIP8, IC SOCKET |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 6-1437532-1 | 功能描述:IC 與器件插座 32 POS THRU HOLE RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點數(shù)量:2011 觸點電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| 6-1437532-7 | 制造商:TE CONNECTIVITY 功能描述: |
| 6-1437532-8 | 功能描述:IC 與器件插座 532-AG38D=SOCKET ASY RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點數(shù)量:2011 觸點電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| 6-1437535-3 | 功能描述:CONN SOCKET SIP 8POS GOLD RoHS:否 類別:連接器，互連式 >> 用于 IC 的插座，晶體管 系列:500 RoHS指令信息:1437504-8 Statement of Compliance 標(biāo)準(zhǔn)包裝:400 系列:8060 類型:晶體管，TO-5 位置或引腳數(shù)目（柵極）:3（圓形） 間距:- 安裝類型:面板安裝 特點:封閉框架 觸點表面涂層:金 觸點涂層厚度:- 其它名稱:8060-1G17 |
| 614375355 | 制造商:TE Connectivity 功能描述: |
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