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參數資料
| 型號： | 6-1437536-4 |
| 元件分類： | 插座 |
| 英文描述： | DIP32, IC SOCKET |
| 文件頁數： | 1/3頁 |
| 文件大小： | 208K |
| 代理商： | 6-1437536-4 |
Sockets
DIP Sockets
532-AG11D-ES
(Tyco Electronics P/N: 6-1437536-4)
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Searchable Features:
Brand:
AMP
RoHS/ELV Compliance:
Non-compliant
Lead Free Solder
Process:
Reflow solder
capable to 245°C
Product Type:
DIP Socket
No. of Positions:
32
Row-to-Row Spacing
(mm [in]):
15.24 [0.600]
Contact Mount:
Thru Hole
Mount Style:
Vertical
Centerline (mm [in]):
2.54 [0.100]
Profile:
Standard
Frame Style:
Closed
Leg Style:
Straight
Contact Material:
Beryllium Copper
Other Properties:
Insulation Resistance
(MΩ):
5,000
Contact Resistance
(mO):
10
Sleeve Material:
Brass/Copper
Contact Termination
Area Plating:
Gold
Product Series:
500 Series
相關PDF資料 |
PDF描述 |
|---|---|
| 6-1437536-5 | DIP32, IC SOCKET |
| 6-1437536-8 | DIP32, IC SOCKET |
| 6-1437537-4 | DIP20, IC SOCKET |
| 6-1437537-6 | DIP20, IC SOCKET |
| 6-1437537-9 | DIP20, IC SOCKET |
相關代理商/技術參數 |
參數描述 |
|---|---|
| 6-1437536-5 | 功能描述:IC 與器件插座 532-AG11D-ESL=SOCKET ASSEMBLY RoHS:否 制造商:Molex 產品:LGA Sockets 節距:1.02 mm 排數: 位置/觸點數量:2011 觸點電鍍:Gold 安裝風格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| 6-1437536-8 | 功能描述:IC 與器件插座 532-AG12D-ES=SOCKET ASSEMBLY RoHS:否 制造商:Molex 產品:LGA Sockets 節距:1.02 mm 排數: 位置/觸點數量:2011 觸點電鍍:Gold 安裝風格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| 6-1437537-0 | 功能描述:IC 與器件插座 818-AG12D=SOCKET ASY RoHS:否 制造商:Molex 產品:LGA Sockets 節距:1.02 mm 排數: 位置/觸點數量:2011 觸點電鍍:Gold 安裝風格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| 6-1437537-4 | 功能描述:IC 與器件插座 20 POS THRU HOLE RoHS:否 制造商:Molex 產品:LGA Sockets 節距:1.02 mm 排數: 位置/觸點數量:2011 觸點電鍍:Gold 安裝風格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| 6-1437537-5 | 制造商:TE Connectivity 功能描述:820-AG10F=SOCKET ASSY - Bulk |
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