
MICROPAC INDUSTRIES, INC.
OPTOELECTRONIC PRODUCTS DIVISION
725 E.Walnut Str., Garland, TX 75040
(972)272-3571
Fax (972)487-6918
www.micropac.com
E-MAIL: OPTOSALES @ MICROPAC.COM
61096
GENERAL PURPOSE (NPN) TRANSISTOR
(2N2222A)
Mii
OPTOELECTRONIC PRODUCTS
DIVISION
Features:
Hermetically sealed
Rugged package-able to withstand high
acceleration load
TO-18 package
MIL-PRF-19500 screening available
Applications:
Analog Switches
Signal Conditioning
Small Signal Amplifiers
High Density Packaging
DESCRIPTION
The
61096
is a hermetically sealed general purpose switching transistor in a TO-18 package. This rugged package is able to
withstand high acceleration loads and is ideal for designs where durability and device weight are important requirements. This
device is available custom binned to customer specifications or screened to MIL-PRF-19500.
ABSOLUTE MAXIMUM RATINGS
Collector-Base Voltage ..............................................................................................................................................................75V
Collector-Emitter Voltage...........................................................................................................................................................50V
Emitter-Collector Voltage.............................................................................................................................................................6V
Continuous Collector Current................................................................................................................................................800mA
Power Dissipation (Derate at the rate of 3.33 mW/°C above 25°C) ..................................................................................500mW
Maximum Junction Temperature .........................................................................................................................................+200°C
Operating Temperature (See part selection guide for actual operating temperature) .........................................-65°C to +200°C
Storage Temperature.............................................................................................................................................-65°C to +200°C
Lead Soldering Temperature (vapor phase reflow for 30 seconds) ..................................................................................... 215°C
Package Dimensions Schematic Diagram
1
2
3
[1.17]
[0.91]
0.036
0.046
0.048
[1.22]
0.028
[0.71]
45°
DIMENSIONS ARE IN INCHES (MILLIMETERS)
0.170
0.500 ([12.70] MAX
0.750 [19.05] MIN
0.210
[4.32]
[5.33]
0.030 [0.76)] MAX
0.178 (4.52)
0.195 (4.95)
3 LEADS
0.021 [0.53]
0.016 [0.41]
0.209 (5.31)
0.230 (5.84)
0.100 [2.54]
COLLECTOR
BASE
EMITTER
3
1
2
B
E
C