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參數資料
型號: 6225B-MTG
廠商: Aavid Thermalloy
文件頁數: 23/116頁
文件大小: 0K
描述: BOARD LEVEL HEAT SINK
產品培訓模塊: How to Select a Heat Sink
標準包裝: 1,000
類型: 插件板級,垂直
冷卻式包裝: TO-220
固定方法: 螺栓固定和 PC 引腳
形狀: 矩形
長度: 1.070"(27.18mm)
寬: 1.024"(26.00mm)
機座外的高度(散熱片高度): 0.315"(8.00mm)
溫升時的功耗: 2W @ 40°C
在強制氣流下的熱敏電阻: 在 700 LFM 時為3°C/W
自然環境下的熱電阻: 15°C/W
材質:
材料表面處理: 黑色陽極化處理
其它名稱: 042056
14
HEA
T
SINKS
F
OR
IC
P
A
CK
A
GES
EUROPE
ASIA
Italy Tel: +39 051 764011 email: sales.it@aavid.com
United Kingdom Tel: +44 1793 401400 email: sales.uk@aavid.com
Singapore Tel: +65 6362 8388 email: sales@aavid.com.sg
Taiwan Tel: +886(2) 2698-9888 email: sales@aavid.com.tw
AMERICA
USA Tel: +1 (603) 224-9988 email: info@aavid.com
www.aavidthermalloy.com
ORDERING INFORMATION
Push pin attachment
Push pin heat sinks require two 3.10mm holes in the circuit card
to quickly attach the heat sink over the device. The one piece
design makes assembly a snap. Pressure is maintained by the
tension of the push pin coil springs to ensure even pressure
across the device. Push pins provide a greater margin of reliabil-
ity in applications where gravity or vibration may cause tapes or
adhesives to fail. The addition of a phase change pad optimizes
thermal performance.
IC Pkg. Size (mm)
Part Number
“W” (mm)
“L” (mm)
“H” (mm)
“S” (mm)
“T” (mm)
θn
2
θf
3
Finish
Fig.
PCB Fig.
1
Pin Style
Pad
28 x 28
10-6326-27G
28.00
6.00
46.60
6.50
44.10
13.13
Black anodize
1
A
Plastic
Yes
28 x 28
10-6326-28G
28.00
6.00
46.60
6.50
44.10
13.13
Black anodize
1
A
Brass
Yes
28 x 28
10-6327-01G
28.50
10.00
46.60
7.00
30.60
9.26
Black anodize
2
A
Plastic
No
35 x 35
10-TNT2-01G
36.10
48.00
11.60
6.50
18.80
6.13
Black anodize
3
D
Plastic
No
37.5 x 37.5
10-5597-02G
37.40
6.00
59.00
6.50
33.30
9.91
Green anodize
5
B
Plastic
No
37.5 x 37.5
10-5597-22G
37.40
6.00
59.00
6.50
33.30
9.91
Gold anodize
5
B
Plastic
Yes
37.5 x 37.5
10-5597-33G
37.40
6.00
59.00
6.50
33.30
9.91
Gold anodize
5
B
Brass
Yes
37.5 x 37.5
10-5607-04G
37.40
10.00
59.00
7.00
22.10
6.99
Black anodize
5
B
Plastic
Yes
37.5 x 37.5
10-5607-05G
37.40
10.00
59.00
7.00
22.10
6.99
Black anodize
5
B
Brass
Yes
37.5 x 37.5
372924M02000G
37.40
6.00
59.00
6.50
32.60
9.91
Green anodize
5
B
Plastic
No
45 x 45
10-L4LB-03G
45.20
41.40
11.89
58.80
8.00
16.70
5.60
Black anodize
4
C
Plastic
Yes
45 x 45
10-L4LB-05G
45.20
41.40
11.89
58.80
8.00
16.70
5.60
Black anodize
4
C
Brass
Yes
45 x 45
10-L4LB-11G
45.20
41.40
11.70
58.80
8.00
14.20
4.91
Black anodize
4
C
Plastic
No
BGA–Push Pin Attachment
1. Push pin mechanical drawings and board mounting drawings see page 15
2. Natural convection thermal resistance based on a 75° C heat sink temperature rise.
3. Forced convection thermal resistance based on an entering 1.0 m/s (200LFM) airflow.
相關PDF資料
PDF描述
5767044-2 CONN RCPT 76POS R/A .025 SMD
SOMC160336R0GEA RES ARRAY 36 OHM 8 RES 16-SOIC
5767061-3 CONN RCPT 114POS .025 VERT SMD
574502B03200G BOARD LEVEL HEAT SINK
5767081-3 CONN RCPT 114POS .025 VERT SMD
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