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參數(shù)資料
| 型號(hào)： | 65526-409 |
| 元件分類： | 電路板相疊連接器 |
| 英文描述： | 9 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER |
| 文件頁數(shù)： | 1/3頁 |
| 文件大小： | 259K |
| 代理商： | 65526-409 |
PDM: Rev:AD
Released
.
STATUS:
Printed: Nov 06, 2006
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| 65526-410 | 10 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER |
| 65526-411 | 11 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER |
| 65526-412 | 12 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER |
| 65526-413 | 13 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER |
| 65526-414 | 14 CONTACT(S), MALE, RIGHT ANGLE TWO PART BOARD CONNECTOR, SOLDER |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 655-26AB | 制造商:Wakefield Thermal Solutions 功能描述:HEAT SINK 制造商:Wakefield Thermal Solutions 功能描述:HEAT SINK; Packages Cooled:BGA; External Height - Imperial:0.26"; External Height - Metric:6.6mm; External Width - Imperial:1.598"; External Width - Metric:40.6mm; External Length - Imperial:1.598"; External Length - Metric:40.6mm ;RoHS Compliant: Yes 制造商:Wakefield 功能描述:Heat Sink Passive BGA Pin Array Adhesive Black Anodized 制造商:WAKEFIELD-VETTE 功能描述:BOARD LEVEL HEAT SINK 制造商:WAKEFIELD THERMAL SOLUTIONS 功能描述:Heat Sink Passive BGA Pin Array Adhesive Black Anodized |
| 655-26ABT1E | 制造商:Wakefield Thermal Solutions 功能描述:655 Series 40.6 x 40.6 x 6.6 mm Black Anodized Omnidirectional Heat Sink 制造商:Wakefield Thermal Solutions 功能描述:40mm BGA H/S .260X.125 w/T405R 制造商:WAKEFIELD-VETTE 功能描述:BOARD LEVEL HEAT SINK 制造商:WAKEFIELD THERMAL SOLUTIONS 功能描述:Heatsink |
| 655-26ABT3 | 制造商:WAKEFIELD-VETTE 功能描述:BOARD LEVEL HEAT SINK 制造商:WAKEFIELD THERMAL SOLUTIONS 功能描述:Heatsink |
| 655-26ABT4 | 制造商:WAKEFIELD-VETTE 功能描述:BOARD LEVEL HEAT SINK |
| 655-26ABT4E | 制造商:WAKEFIELD-VETTE 功能描述:BOARD LEVEL HEAT SINK 制造商:WAKEFIELD THERMAL SOLUTIONS 功能描述:Heatsink |
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