
MICROPAC INDUSTRIES, INC.
OPTOELECTRONIC PRODUCTS DIVISION
725 E.Walnut Str., Garland, TX 75040
(972)272-3571
Fax (972)487-6918
www.micropac.com
E-MAIL: OPTOSALES @ MICROPAC.COM
66053
SINGLE-CHANNEL, LOW-INPUT CURRENT
LEADLESS CHIP CARRIER OPTOCOPLER
Mii
OPTOELECTRONIC PRODUCTS
DIVISION
Features:
Electrically similar to 6N140
Hermetically sealed 24 Pin LCC
High Current Transfer ratio: 1000% typical
CTR and 1
OH
guaranteed over 55°C to + 125°C
ambient temperature range
Standard and high reliability screened parts
available
1000 Vdc isolation test voltage
Low input current requirement: 0.5mA
Low output saturation voltage: 0.1V typical
Low power consumption
Leadless chip carrier package
Faraday shield provides high common mode
rejection
DESCRIPTION
The 66053 optocoupler contains an infrared LED optically
coupled to a corresponding high gain darlington detector.
This unique optocoupler provides high CTR and low
leakage current over the full military temperature range (-
55°C to + 125°C). The 66053 is a 24 pin hermetically sealed
leadless chip carrier and is available in standard and
screened versions or tested to customer specifications.
RECOMMENDED OPERATING CONDITIONS
PARAMETER
SYMBOL
MIN
MAX
UNITS
Input Current, Low
Level Each Channel
I
FL
2
μA
Input Current, High
Level Each Channel
I
FH
0.5
5
mA
Supply Voltage
V
CC
2.0
18
V
ABSOLUTE MAXIMUM RATINGS
Output current - I
O
...........................................................................................................................................................................................................................................................................
40mA
Output voltage - V
O
.....................................................................................................................................................-0.5 to 20V (1)
Supply voltage - V
CC
....................................................................................................................................................-0.5 to 20V (1)
Output power dissipation ..................................................................................................................................................50 mW (2)
Storage temperature ...............................................................................................................................................-65°C to +150°C
Operating temperature.............................................................................................................................................-55°C to +125°C
Lead solder temperature .......................................................................................................................................260°C for 10 sec.
Peak input current (<1ms duration) .........................................................................................................................................20mA
Reverse input voltage - V
R
.............................................................................................................................................................5V
Average input current - I
F
.................................................................................................................................................... 10mA (3)
Notes:
1.
The lowest total I
OH
over temperature is developed by keeping V
CC
as low as possible, but greater than 2.0 volts. The negative voltage at the
detector side should be applied to PIN 10.
2.
Collector output power plus one fourth of the total supply power is total output power. Derate at 0.46mW/°C above 25°C.
3.
Derate I
F
at 0.05mA /°C above 25°C.
Package Dimensions Schematic Diagram
NO. 1 LEAD
IDENTIFIER
Mii 66053
XXXXX
0.008
[.203]
K
1
A
2
GND
Vo
Vcc
10
14
15
[10.160 +.254,-.127]
[1.778]
[1.270]
[.889]
REF.
RAD,TYP
0.020
(.508)
[1.143]
0.045
0.070
0.050
0.035
0.400+.010,-.055