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參數(shù)資料
| 型號： | 7-1437529-1 |
| 元件分類： | 插座 |
| 英文描述： | DIP6, IC SOCKET |
| 文件頁數(shù)： | 1/3頁 |
| 文件大小： | 108K |
| 代理商： | 7-1437529-1 |
Part Details for P/N: 506-AG12D
Sockets
DIP Sockets
506-AG12D Active Active
(Tyco Electronics P/N: 7-1437529-1)
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Searchable Features:
Brand:
AMP
RoHS/ELV Compliance:
Non-compliant
Lead Free Solder
Process:
Reflow solder
capable to 245°C
Product Type:
DIP Socket
No. of Positions:
6
Row-to-Row Spacing
(mm [in]):
7.62 [0.300]
Contact Mount:
Thru Hole
Mount Style:
Vertical
Centerline (mm [in]):
2.54 [0.100]
Other Properties:
Insulation Resistance (M
):
5,000
Contact Resistance (mO):
10
Sleeve Material:
Brass/Copper
Contact Termination Area
Plating:
Tin-Lead
Product Series:
500 Series
file://///Garuda/E/AMPI/AMPI3/7-1437529-1.html (1 of 2) [08-Sep-05 10:29:56 PM]
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PDF描述 |
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| 7-1437529-5 | DIP8, IC SOCKET |
| 7-1437529-9 | DIP8, IC SOCKET |
| 7-1437531-3 | DIP18, IC SOCKET |
| 7-1437531-5 | DIP18, IC SOCKET |
| 7-1437531-8 | DIP20, IC SOCKET |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| 7-1437529-5 | 功能描述:IC 與器件插座 SOCKET RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點數(shù)量:2011 觸點電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| 7-1437529-6 | 功能描述:CONN SOCKET DIP 8POS GOLD WW RoHS:是 類別:連接器，互連式 >> 用于 IC 的插座，晶體管 系列:500 產(chǎn)品目錄繪圖:A-CCS Series Through Hole 52-Position 標準包裝:23 系列:- 類型:芯片載體，PLCC 位置或引腳數(shù)目（柵極）:52（4 x 13） 間距:0.050"（1.27mm） 安裝類型:通孔 特點:封閉框架 觸點表面涂層:錫 觸點涂層厚度:150µin（3.81µm） 產(chǎn)品目錄頁面:545 (CN2011-ZH PDF) 其它名稱:AE10058 |
| 7-1437529-9 | 功能描述:IC 與器件插座 GOLD CNT TIN SLV 8P 9600 RoHS:否 制造商:Molex 產(chǎn)品:LGA Sockets 節(jié)距:1.02 mm 排數(shù): 位置/觸點數(shù)量:2011 觸點電鍍:Gold 安裝風(fēng)格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| 7-1437530-3 | 制造商:TE Connectivity 功能描述:510-AG91D20-IES=500 SERIES SIP - Bulk |
| 7-1437531-3 | 制造商:TE CONNECTIVITY 功能描述:518-AG12D=SOCKET ASSY |
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