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參數資料
| 型號： | 7-1437537-8 |
| 元件分類： | 插座 |
| 英文描述： | DIP22, IC SOCKET |
| 文件頁數： | 1/3頁 |
| 文件大小： | 108K |
| 代理商： | 7-1437537-8 |
Part Details for P/N: 822-AG11D
Sockets
DIP Sockets
822-AG11D Active Active
(Tyco Electronics P/N: 7-1437537-8)
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Searchable Features:
Brand:
AMP
RoHS/ELV Compliance:
Non-compliant
Lead Free Solder Process:
Reflow solder
capable to 245°C
Product Type:
DIP Socket
No. of Positions:
22
Row-to-Row Spacing (mm
[in]):
10.16 [0.400]
Contact Mount:
Thru Hole
Mount Style:
Vertical
Centerline (mm [in]):
2.54 [0.100]
Other Properties:
Insulation Resistance (M
):
5,000
Contact Resistance (mO):
10
Sleeve Material:
Brass
Contact Termination Area
Plating:
Tin-Lead
Product Series:
800 Series
file://///Garuda/E/AMPI/AMPI3/7-1437537-8.html (1 of 2) [08-Sep-05 10:38:11 PM]
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| 7-1437539-0 | DIP24, IC SOCKET |
| 7-1437539-2 | DIP24, IC SOCKET |
| 7-1437539-3 | DIP24, IC SOCKET |
| 7-1437539-4 | DIP24, IC SOCKET |
相關代理商/技術參數 |
參數描述 |
|---|---|
| 7-1437538-3 | 制造商:TE Connectivity 功能描述:818-AG10F-2=SOCKET ASSY - Bulk |
| 7-1437538-6 | 制造商:TE Connectivity 功能描述:822-AG10F=WW DIP SOCKET ASSY - Bulk |
| 7-1437539-0 | 功能描述:IC 與器件插座 824-AG11D-ESL 24P DIP LADDER FRAME RoHS:否 制造商:Molex 產品:LGA Sockets 節距:1.02 mm 排數: 位置/觸點數量:2011 觸點電鍍:Gold 安裝風格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| 7-1437539-2 | 功能描述:IC 與器件插座 824-AG12D-ES SOCKET ASSY RoHS:否 制造商:Molex 產品:LGA Sockets 節距:1.02 mm 排數: 位置/觸點數量:2011 觸點電鍍:Gold 安裝風格:SMD/SMT 端接類型:Solder 插座/封裝類型:LGA 2011 工作溫度范圍:- 40 C to + 100 C |
| 7-1437539-3 | 功能描述:824-AG30D-ES=SOCKET ASSY RoHS:是 類別:連接器，互連式 >> 用于 IC 的插座，晶體管 系列:800 RoHS指令信息:1437504-8 Statement of Compliance 標準包裝:400 系列:8060 類型:晶體管，TO-5 位置或引腳數目（柵極）:3（圓形） 間距:- 安裝類型:面板安裝 特點:封閉框架 觸點表面涂層:金 觸點涂層厚度:- 其它名稱:8060-1G17 |
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