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參數(shù)資料
型號(hào): 70IMX7-05-8M
廠商: POWER-ONE INC
元件分類(lèi): 電源模塊
英文描述: 1-OUTPUT 6.1 W DC-DC REG PWR SUPPLY MODULE
封裝: 2 INCH X 1 INCH, 10.50 MM HEIGHT, PACKAGE-9
文件頁(yè)數(shù): 10/18頁(yè)
文件大小: 175K
代理商: 70IMX7-05-8M
Board Mountable
DC-DC Converters
IMX 7 Series
Edition 4/04.2001
18/18
Option C
The C-pinout configures the electrically isolated double out-
puts to the "industrial pinout" Vo1+, Vo2– with common
ground Go. With the C-pinout the converter height is in-
creased by the adapter PCB (see also:
Mechanical Data).
Option M and L
Surface mount version.
Note: Precautions should be taken when reflow soldering
the SMD version. The reflow soldering instructions below
should be strictly adhered to. An inadequate soldering pro-
cess may permanently damage the converter or degrade
its performance and Power-One will not honour any gua-
rantee/warranty claims resulting from damage caused by
ignoring the soldering instructions.
Infrared soldering is not permitted.
210
220
230
240
0
10
20
30
Tpeak [°C]
11051
40
t [s]
50
205
215
225
235
Fig. 30
Forced convection reflow soldering restriction curve
measured on pin 2
3.81
09119
x
3.81
25.4
3
x
5.8
8
1
4
2
24
(0.94")
2.8
(0.11")
3.6 (1.4")
8 x 5 (1.9")
Foot print
Proposed solder lands
Fig. 32
Proposed solder lands option L
Description of Options
Table 17: Survey of options
Option
Function
Characteristics
-8
Operational temperature range
TA = –40...85°C
Extended temperature range.
L
Surface mount version, SMD
Excludes option C, L.
M
Surface mount version, SMD
Excludes option C, M.
C
C-pinout
Excludes option M, L as well as galvanic isolation between output 1
and 2 of dual output units. Not available for 70/110 IMX 7 types.
Option -8
Extension of the temperature range from standard
–25...71
°C to –40...85°C. The modules will provide full out-
put power with free air convection cooling. UL recognition
up to 80
°C. This option excludes option D.
The surface mountable version of this product is assem-
bled with high melting point solder (227
°C) to ensure that
the solder joints of of the internal components do not de-
grade in the end users SMD soldering process.
This product is only specified for "Forced Convection
Reflow Soldering" (Hot Air). Any conventional soldering
profile is acceptable provided that the restriction curve be-
low is not exceeded at any time during the reflow process.
相關(guān)PDF資料
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