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參數(shù)資料
型號: 74LCX574WMX
廠商: Fairchild Semiconductor
文件頁數(shù): 1/14頁
文件大小: 0K
描述: IC FLIP FLOP OCT D LV 20SOIC
標(biāo)準(zhǔn)包裝: 1
系列: 74LCX
功能: 標(biāo)準(zhǔn)
類型: D 型總線
輸出類型: 三態(tài)非反相
元件數(shù): 1
每個元件的位元數(shù): 8
頻率 - 時鐘: 150MHz
延遲時間 - 傳輸: 8.5ns
觸發(fā)器類型: 正邊沿
輸出電流高,低: 24mA,24mA
電源電壓: 2 V ~ 3.6 V
工作溫度: -40°C ~ 85°C
安裝類型: 表面貼裝
封裝/外殼: 20-SOIC(0.295",7.50mm 寬)
包裝: 標(biāo)準(zhǔn)包裝
其它名稱: 74LCX574WMXDKR
74LCX574
Lo
w
V
olta
g
e
Octal
D-T
ype
Flip-Flop
with
5V
T
olerant
Inputs
and
Outputs
2006 Fairchild Semiconductor Corporation
www.fairchildsemi.com
74LCX574 Rev. 1.6.1
74LCX574
Low Voltage Octal D-Type Flip-Flop
with 5V Tolerant Inputs and Outputs
Features
5V tolerant inputs and outputs
2.3V–3.6V VCC specifications provided
7.5ns tPD max. (VCC = 3.3V), 10A ICC max.
Power down high impedance inputs and outputs
Supports live insertion/withdrawal(1)
±24mA output drive (VCC = 3.0V)
Latch-up performance exceeds JEDEC 78 conditions
ESD performance
– Human body model
> 2000V
– Machine model
> 200V
Note:
1. To ensure the high impedance state during power up
or down, OE should be tied to VCC through a pull-up
resistor: the minimum value of the resistor is
determined by the current-sourcing capability of the
driver.
General Description
The LCX574 is a high-speed, low power octal flip-flop
with a buffered common Clock (CP) and a buffered
common Output Enable (OE). The information presented
to the D inputs is stored in the flip-flops on the LOW-to-
HIGH Clock (CP) transition.
The LCX574 is functionally identical to the LCX374
except for the pinouts.
The LCX574 is designed for low voltage applications
with capability of interfacing to a 5V signal environment.
The LCX574 is fabricated with an advanced CMOS
technology to achieve high speed operation while main-
taining CMOS low power dissipation.
Ordering Information
Note:
2. DQFN package available in Tape and Reel only.
Device also available in Tape and Reel. Specify by appending suffix letter “X” to the ordering number.
All packages are lead free per JEDEC: J-STD-020B standard.
Order
Number
Package
Number
Package Description
74LCX574WM
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74LCX574SJ
M20D
20-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide
74LCX574BQX(2)
MLP20B
20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC
MO-241, 2.5 x 4.5mm
74LCX574MSA
MSA20
20-Lead Shrink Small Outline Package (SSOP), JEDEC MO-150, 5.3mm Wide
74LCX574MTC
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm
Wide
Implements proprietary noise/EMI reduction circuitry
December 2013
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