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參數資料
| 型號： | 74VCX245WMX |
| 廠商： | Fairchild Semiconductor |
| 文件頁數： | 1/11頁 |
| 文件大小： | 0K |
| 描述： | IC TRANSCVR BIDIRECT LV 20SOIC |
| 標準包裝： | 1 |
| 系列： | 74VCX |
| 邏輯類型： | 收發器，非反相 |
| 元件數： | 1 |
| 每個元件的位元數： | 8 |
| 輸出電流高，低： | 24mA，24mA |
| 電源電壓： | 1.4 V ~ 3.6 V |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 20-SOIC（0.295"，7.50mm 寬） |
| 供應商設備封裝： | 20-SOIC |
| 包裝： | 標準包裝 |
| 其它名稱： | 74VCX245WMXDKR |
2013 Fairchild Semiconductor Corporation
DS500167
www.fairchildsemi.com
June 1999
Revised December 2013
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74VCX245
Low Voltage Bidirectional Transceiver
with 3.6V Tolerant Inputs and Outputs
General Description
The VCX245 contains eight non-inverting bidirectional buff-
ers with 3-STATE outputs and is intended for bus oriented
applications. The T/R input determines the direction of data
flow. The OE input disables both the A and B ports by plac-
ing them in a high impedance state.
The 74VCX245 is designed for low voltage (1.4V to 3.6V)
VCC applications with I/O compatibility up to 3.6V.
The 74VCX245 is fabricated with an advanced CMOS
technology to achieve high-speed operation while main-
taining low CMOS power dissipation.
Features
s 1.4V to 3.6V VCC supply operation
s 3.6V tolerant inputs and outputs
s Power-off high impedance inputs and outputs
s Supports Live Insertion and Withdrawal (Note 1)
s tPD
3.5 ns max for 3.0V to 3.6V VCC
s Static Drive (IOH/IOL)
r24 mA @ 3.0V VCC
circuitry
s Latchup performance exceeds 300 mA
s ESD performance:
Human body model
! 2000V
Machine model
! 200V
s Leadless DQFN Pb-Free package
Note 1: To ensure the high impedance state during power up and power
down, OEn should be tied to VCC through a pull up resistor. The minimum
value of the resistor is determined by the current sourcing capability of the
driver.
Ordering Code:
Pb-Free package per JEDEC J-STD-020B.
Note 2: Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
Note 3: DQFN package available in Tape and Reel only,
Logic Symbol
Pin Descriptions
Order Number
Package
Number
Package Description
74VCX245WM
(Note 2)
M20B
20-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-013, 0.300" Wide
74VCX245BQX
(Note 3)
MLP020B
Pb-Free 20-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC
MO-241, 2.5 x 4.5mm
74VCX245MTC
(Note 2)
MTC20
20-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
Pin Names
Description
OE
Output Enable Input (Active LOW)
T/R
Transmit/Receive Input
A0–A7
Side A Inputs or 3-STATE Outputs
B0–B7
Side B Inputs or 3-STATE Outputs
s Uses proprietary noise/EMI reduction
DAP
No Connect
Note: DAP (Die Attach Pad)
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