POWER
WATTS
5
PART
NUMBER
83-3995
W
L
H
w
l
FREQUENCY
MAX.
VSWR
1.50:1
0.200
0.175
0.040
0.071
0.049
DC - 3.0 GHz
C
HIP
C
OMPONENTS
B
ERYLLIUM
O
XIDE
D
UO
W
RAP
S
URFACE
M
OUNT
A
TTENUATORS
Duo Wrap Surface Mount Chip Attenuators are designed
for installation directly on printed circuit boards. Edge
metallization on two sides forms solder fillets for stronger
attachment, easier inspection and increased heat removal
area.
GENERAL SPECIFICATIONS
Impedance . . . . . . . . . . . . . . 50 Ohms
Operating Temperature . . . . -55C to 150C
Attenuation Stability . . . . . . 0.0001 dB/dB/C
Attenuation Tolerance . . . . . 1 - 10 dB ± 0.5 dB
11 - 20 dB ± 1.0 dB
Other attenuation values available upon request.
MATERIAL SPECIFICATIONS
Solderable
Ground Plane . . . . . . . TIN/LEAD over Nickel
Substrate . . . . . . . . . . . . Beryllium Oxide Ceramic
Resistive Elements . . . . Proprietary Nichrome Thin Film
Environment. . . . . . . . . Meets applicable portions of
MIL-E-5400 and MIL-R-55342
NOTES
Power ratings are average power and based on
maximum film temperature of 150C and heat sink
temperature of 100C maximum.
ORDERING INFORMATION
Example . . . . . . . . . . . . . . . . . . . . . . . 83-3XXX - XX.XX
Chip Attenuator
TIN/LEAD over Nickel
Attenuation Value
w
l