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參數資料
| 型號： | 835-93-072-10-001000 |
| 廠商： | MILL-MAX MFG CORP |
| 元件分類： | 電路板相疊連接器 |
| 英文描述： | 72 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER, SOCKET |
| 文件頁數： | 1/1頁 |
| 文件大小： | 193K |
| 代理商： | 835-93-072-10-001000 |
INTERCONNECTS
2,54 Grid OFP Pass Through Sockets for 0,76 &
0,64 pins
Single and Double Row
www.mill-max.com
516-922-6000
87
Series 834, 835
2,54
X 2,54 / 2
Number of Pins
0,64-0,91
0,64
0,64 0,64
0,64
5,08
2,24
2,79
3,3
2,03
2,54
1,09 DIA.
1,55 DIA.
0,91 DIA.
1,09 DIA.
1,55 DIA.
2,79
2,54
3,3
2,03
2,54
2,24
0,91 DIA.
X 2,54
Number of Pins
0,64-0,91
0,64
0,64 0,64
0,64
UPPER
CIRCUIT
BOARD
MIDDLE
CIRCUIT
BOARD
LOWER
CIRCUIT
BOARD
INTER-CONNECTION
PIN
PASS THRU
SOCKETS
#47 SPRING
CONTACT
SOCKET
INSULATOR
SOCKET
SLEEVE
CIRCUIT
BOARD
SOLDER
JOINT
ORGANIC FIBER PLUG
PUSHED OUT BY INTER-CONNECT
PIN AFTER SOLDERING
0,76 or
0,64 PINS
Ordering Information
Single Row OFP Pass Through Socket
834-XX-0 _ _-10-001000
Fig. 1
Specify # of pins
01-64
Double Row OFP Pass Through Socket
835-XX-0 _ _-10-001000
Fig. 2
Specify # of pins
02-72
834/835 Series Pass Through Sockets have a
low 3,30 profile and will accept 0,76 round
pin, as well as industry standard 0,64 square
pin headers.
They are typically used to interconnect two or
more parallel circuit boards.
Sockets are designed for hand, wave or reflow*
soldering. The high temp. insulator is compati-
ble with all solder processes.
Unique ORGANIC FIBRE PLUG barriers pre-
vent solder, paste or flux from contaminating
the internal spring contacts. After soldering, the
OFP barriers are pushed out of the socket
when the mating header is inserted.
Mill-Max sockets use a precision-machined
brass sleeve with a press-fit beryllium copper
“multi-finger” spring contact.
Recommended mounting holes are 1,17
±0,08 PTH (1,2 mm drilled prior to plating).
*Intrusive reflow (also called "pin-in-paste") is a
technique of using conventional through-hole
components in a reflow soldering process. The pass
through socket is placed into plated through-holes in
the circuit board (solder paste has previously been
screen printed on pads adjacent to the holes) and
the board is reflowed in the same pass as other SMT
components. Solder will fill the plated through-holes
and achieve solder joints as reliable as wave solder-
ing. The OFP barrier prevents solder paste from
being picked-up inside the contact during assembly.
Fig. 1
Fig. 2
Typical Application
US Patent #7,086,870
SPECIFY PLATING CODE XX=
13
93
99
43
44
Sleeve (Pin)
Contact (Clip)
RoHS
2002/95/EC
XX=Plating Code
See Below
For Electrical,
Mechanical & Enviromental
Data, See pg. 4
For RoHS compliance
select plating code.
5,08m Sn/Pb
5,08m Sn
0,76m Au
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