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參數資料
| 型號： | 9-1414964-1 |
| 元件分類： | 功率/信號繼電器 |
| 英文描述： | POWER/SIGNAL RELAY, SPDT, MOMENTARY, 0.067A (COIL), 12VDC (COIL), 800mW (COIL), 20A (CONTACT), 12VDC (CONTACT), THROUGH HOLE-STRAIGHT MOUNT |
| 封裝： | ROHS COMPLIANT |
| 文件頁數： | 5/5頁 |
| 文件大小： | 371K |
| 代理商： | 9-1414964-1 |
Single Nano Relay (THT – THR)
PCB Relays
Single Relays
Catalog 1308028-2
Revised 8-2009
All specifications subject to change. Consult Tyco Electronics for latest specifications.
110
Part Numbers
(see table below for coil data)
Contact
Enclosure
Soldering
Relay Description
Part Number
Arrangement
Material
Technology
V23138-C1005-A403
9-1414964-1
1 Form C
Silver based
Sealed
THT
V23138-R1005-A403
1-1414960-7
1 Form C
Silver based
Open vent hole
THR
Coil Versions
Ordering Information
Coil Data
Rated Coil
Coil Resistance
Must
Allowable Overdrive1)
for
Voltage
±10%
Operate Voltage
Release Voltage
Voltage (V)
Nano Single
(V)
(
Ω)
(V)
at 23°C
at 105°C
V23138-**005-****
12
180
6.9
1.0
24
14.7
1) Allowable overdrive is stated with no load applied and minimum coil resistance.
Standard Delivery Packs (orders in multiples of delivery pack)
Nano Single:
2600 pieces
Environmental Conditions
Temperature range, storage
Refer to
Storage in the “Glossary” catalog page 23 or http://relays.tycoelectronics.com/appnotes/
Test
Relevant standard
Testing as per
Dimension
Comments
Cold storage
IEC 68-2-1
1000 h
–40°C
Dry heat
IEC 68-2-2
Ba
1000 h
125°C
Climatic cycling with condensation
THT
EN ISO 6988
20 cycles
Storage 8/16 h
Thermal change
IEC 68-2-14
Nb
35 cycles
–40/+125°C
Thermal shock
IEC 68-2-14
Na
1000 cycles
–40/+125°C
Dwell time 1 h
Damp heat
cyclic
THT
IEC 68-2-30
Db, Variant 2
6 cycles
40°C/55°C/93%
constant
THT
IEC 68-2-3
Method Ca
56 days
40°C/ 93%
Corrosive gas
IEC 68-2-42
10 days
IEC 68-2-43
10 days
Vibration resistance
IEC 68-2-6 (sine pulse form)
10 - 500 Hz
No change in the
6 g
switching state > 10
μs
Shock resistance
IEC 68-2-27 (half sine form single pulses)
6 ms
No change in the
up to 30 g
switching state > 10
μs
Solderability
Hot dip 5 s
Aging 3 (4 h/ 155°C)
THT
IEC 68-2-20
Ta, Method 1
215°C
for leaded process (Tm = 183°C)
THR
IEC 68-2-58
245°C
for Pb-free process (Tm = 217°C)
Resistance to soldering heat
Hot dip 10 s
with thermal screen
THT
IEC 68-2-20
Ta, Method 1A
260°C
THR
IEC 68-2-58
260°C
Preheating min 130°C
Sealing
THT
IEC 68-2-17
Qc, Method 2
1 min/ 70°C
THR
Open vent hole
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