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參數(shù)資料
| 型號： | 9222-2-55-01-02-01-40-0 |
| 廠商： | MILL-MAX MFG CORP |
| 元件分類： | 終端 |
| 英文描述： | BERYLLIUM COPPER ALLOY, TIN LEAD FINISH, PCB TERMINAL |
| 文件頁數(shù)： | 1/2頁 |
| 文件大小： | 227K |
| 代理商： | 9222-2-55-01-02-01-40-0 |
MAXIMUM
solutions
R
Maximum Interconnect Solutions
Mill-Max Mfg. Corp. 190 Pine Hollow Road, Oyster Bay, NY 11771-0300
516-922-6000 Fax: 516-922-9253 www.mill-max.com
Receptacles on Tape for Automated Assembly
Mill-Max offers receptacles (discrete sockets) on carrier tape per EIA-481 to feed automated ‘pick &
place’ assembly equipment. Our standard reel size has been 13”, but now for 8 & 12mm wide carrier tapes,
we also offer the new 7” ‘mini’ reel. A 7” reel holds about one quarter the parts of a 13” reel. This is more
economic and convenient for smaller volume customers who want the benefit of automated assembly.
Two types of receptacles are available on carrier tape: surface mount, flat types, which sit on the
surface of the PCB where the pin or component lead plugs-in parallel to the PCB; and thru-hole types
where the lead plugs-in perpendicular to the PCB. Thru-hole receptacles are intrusive reflow soldered*.
Our increasingly popular thru-hole (tubular) receptacles have an Organic Fibre Plug barrier which
prevents solder, paste or flux from contaminating the spring contact. After soldering, the OFP
barrier is pushed out of the receptacle when the device is plugged in.
Also new for Mill-Max is the availability of RoHS “l(fā)ead free” plating options. Instead of traditional
tin/lead plating on the receptacle’s shell and contact, a pure matte tin with oxide and whisker inhibitors
can be specified.
*Intrusive reflow (also called "pin-in-paste") is a technique of using conventional thru-hole components in a reflow soldering
process. The receptacles are placed into plated-thru-holes in the circuit board (solder paste has previously been screen printed
on pads adjacent to the holes) and the board is reflowed in the same pass as other SMT components. Solder will fill the plated-
thru-holes and achieve solder joints as reliable as wave soldering. The OFP barrier prevents solder paste from being picked-
up inside the contact during pick ‘n place assembly. "Overprinting" paste on the solder mask can be used to adjust the volume
of paste required to fill each hole.
(02/06-558)
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