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參數資料
| 型號： | 933768140118 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 模擬信號調理 |
| 英文描述： | SPECIALTY ANALOG CIRCUIT, PDSO16 |
| 封裝： | 7.50 MM, PLASTIC, MS-013, SOT-162-1, SO-16 |
| 文件頁數： | 16/28頁 |
| 文件大小： | 139K |
| 代理商： | 933768140118 |
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2003 Jan 27
23
Philips Semiconductors
Product specication
8-bit A/D and D/A converter
PCF8591
17 SOLDERING
17.1
Introduction to soldering through-hole mount
packages
This text gives a brief insight to wave, dip and manual
soldering. A more in-depth account of soldering ICs can be
found in our
“Data Handbook IC26; Integrated Circuit
Packages” (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
17.2
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is
260
°C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.
The total contact time of successive solder waves must not
exceed 5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg(max)). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
17.3
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300
°C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400
°C, contact may be up to 5 seconds.
17.4
Suitability of through-hole mount IC packages for dipping and wave soldering methods
Note
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
PACKAGE
SOLDERING METHOD
DIPPING
WAVE
DBS, DIP, HDIP, SDIP, SIL
suitable
suitable(1)
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