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參數(shù)資料
| 型號： | 935146220025 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 模擬波形發(fā)生器 |
| 英文描述： | DUAL PULSE; RECTANGULAR, TIMER, UUC |
| 封裝： | DIE |
| 文件頁數(shù)： | 5/10頁 |
| 文件大?。?/td> | 96K |
| 代理商： | 935146220025 |
Philips Semiconductors
Product data
NE/SA556
Dual timer
2001 Aug 03
4
ABSOLUTE MAXIMUM RATINGS
SYMBOL
PARAMETER
RATING
UNIT
VCC
Supply voltage
+16
V
PD
Maximum allowable power dissipation1
800
mW
Operating temperature range
Tamb
NE556
0 to +70
°C
SA556
-40 to +85
°C
Tstg
Storage temperature range
-65 to +150
°C
TSOLD
Lead soldering temperature (10 sec max)
+230
°C
NOTE:
1. The junction temperature must be kept below 125
°C for the D package and below 150 °C for the N package. At ambient temperatures
above 25
°C, where this limit would be exceeded, the Maximum Allowable Power Dissipation must be derated by the following:
D package 115
°C/W
N package 80
°C/W
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