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參數資料
| 型號： | 935256880112 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 穩壓器 |
| 英文描述： | 0.25 A SWITCHING REGULATOR, 50 kHz SWITCHING FREQ-MAX, PDIP8 |
| 封裝： | SOT-97, DIP-8 |
| 文件頁數： | 9/22頁 |
| 文件大小： | 154K |
| 代理商： | 935256880112 |
1998 Aug 19
17
Philips Semiconductors
Preliminary specication
Greeny; GreenChip
TEA1501
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260
°C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300
°C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400
°C, contact may be up to 5 seconds.
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