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參數(shù)資料
| 型號(hào)： | A3PN125-ZFVQG100 |
| 元件分類： | FPGA |
| 英文描述： | FPGA, 3072 CLBS, 125000 GATES, PQFP100 |
| 封裝： | 14 X 14 MM, 1.20 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, VQFP-100 |
| 文件頁(yè)數(shù)： | 56/92頁(yè) |
| 文件大小： | 3184K |
| 代理商： | A3PN125-ZFVQG100 |
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ProASIC3 nano Device Overview
1- 2
A d vance v0.4
Security, built into the FPGA fabric, is an inherent component of ProASIC3 nano devices. The flash
cells are located beneath seven metal layers, and many device design and layout techniques have
been used to make invasive attacks extremely difficult. ProASIC3 nano devices, with FlashLock and
AES security, are unique in being highly resistant to both invasive and noninvasive attacks. Your
valuable IP is protected and secure, making remote ISP possible. A ProASIC3 nano device provides
the most impenetrable security for programmable logic designs.
Single Chip
Flash-based FPGAs store their configuration information in on-chip flash cells. Once programmed,
the configuration data is an inherent part of the FPGA structure, and no external configuration
data needs to be loaded at system power-up (unlike SRAM-based FPGAs). Therefore, flash-based
ProASIC3 nano FPGAs do not require system configuration components such as EEPROMs or
microcontrollers to load device configuration data. This reduces bill-of-materials costs and PCB
area, and increases security and system reliability.
Live at Power-Up
Actel flash-based ProASIC3 nano devices support Level 0 of the LAPU classification standard. This
feature helps in system component initialization, execution of critical tasks before the processor
wakes up, setup and configuration of memory blocks, clock generation, and bus activity
management. The LAPU feature of flash-based ProASIC3 nano devices greatly simplifies total
system design and reduces total system cost, often eliminating the need for CPLDs and clock
generation PLLs that are used for these purposes in a system. In addition, glitches and brownouts in
system power will not corrupt the ProASIC3 nano device's flash configuration, and unlike SRAM-
based FPGAs, the device will not have to be reloaded when system power is restored. This enables
the reduction or complete removal of the configuration PROM, expensive voltage monitor,
brownout detection, and clock generator devices from the PCB design. Flash-based ProASIC3 nano
devices simplify total system design and reduce cost and design risk while increasing system
reliability and improving system initialization time.
Firm Errors
Firm errors occur most commonly when high-energy neutrons, generated in the upper atmosphere,
strike a configuration cell of an SRAM FPGA. The energy of the collision can change the state of the
configuration cell and thus change the logic, routing, or I/O behavior in an unpredictable way.
These errors are impossible to prevent in SRAM FPGAs. The consequence of this type of error can be
a complete system failure. Firm errors do not exist in the configuration memory of ProASIC3 nano
flash-based FPGAs. Once it is programmed, the flash cell configuration element of ProASIC3 nano
FPGAs cannot be altered by high-energy neutrons and is therefore immune to them. Recoverable
(or soft) errors occur in the user data SRAM of all FPGA devices. These can easily be mitigated by
using error detection and correction (EDAC) circuitry built into the FPGA fabric.
Low Power
Flash-based ProASIC3 nano devices exhibit power characteristics similar to an ASIC, making them an
ideal choice for power-sensitive applications. ProASIC3 nano devices have only a very limited
power-on current surge and no high-current transition period, both of which occur on many
FPGAs.
ProASIC3 nano devices also have low dynamic power consumption to further maximize power
savings.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| A3PN125-ZVQ100 | 功能描述:IC FPGA NANO 125K GATES 100-VQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:ProASIC3 nano 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應(yīng)商設(shè)備封裝:289-CSP（14x14） |
| A3PN125-ZVQ100I | 功能描述:IC FPGA NANO 125K GATES 100-VQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:ProASIC3 nano 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應(yīng)商設(shè)備封裝:289-CSP（14x14） |
| A3PN125-ZVQG100 | 功能描述:IC FPGA NANO 125K GATES 100-VQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:ProASIC3 nano 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應(yīng)商設(shè)備封裝:289-CSP（14x14） |
| A3PN125-ZVQG100I | 功能描述:IC FPGA NANO 125K GATES 100-VQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:ProASIC3 nano 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應(yīng)商設(shè)備封裝:289-CSP（14x14） |
| A3PN250-1VQ100 | 功能描述:IC FPGA NANO 250K GATES 100-VQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA（現(xiàn)場(chǎng)可編程門陣列） 系列:ProASIC3 nano 標(biāo)準(zhǔn)包裝:152 系列:IGLOO PLUS LAB/CLB數(shù):- 邏輯元件/單元數(shù):792 RAM 位總計(jì):- 輸入/輸出數(shù):120 門數(shù):30000 電源電壓:1.14 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 85°C 封裝/外殼:289-TFBGA，CSBGA 供應(yīng)商設(shè)備封裝:289-CSP（14x14） |
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