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參數資料
型號: A40MX04-1PQ100IX79
元件分類: FPGA
英文描述: FPGA, 547 CLBS, 6000 GATES, 92 MHz, PQFP100
封裝: PLASTIC, QFP-100
文件頁數: 87/124頁
文件大小: 3142K
代理商: A40MX04-1PQ100IX79
40MX and 42MX FPGA Families
v6.1
1-59
Table 35
A42MX16 Timing Characteristics (Nominal 3.3V Operation)
(Worst-Case Commercial Conditions, VCCA = 3.0V, TJ = 70°C)
‘–3’ Speed
‘–2’ Speed
‘–1’ Speed
‘Std’ Speed
‘–F’ Speed
Parameter Description
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max.
Min.
Max. Units
Logic Module Propagation Delays1
tPD1
Single Module
1.9
2.1
2.4
2.8
4.0
ns
tCO
Sequential Clock-to-Q
2.0
2.2
2.5
3.0
4.2
ns
tGO
Latch G-to-Q
1.9
2.1
2.4
2.8
4.0
ns
tRS
Flip-Flop (Latch) Reset-to-Q
2.2
2.4
2.8
3.3
4.6
ns
Logic Module Predicted Routing Delays2
tRD1
FO=1 Routing Delay
1.1
1.2
1.4
1.6
2.3
ns
tRD2
FO=2 Routing Delay
1.5
1.6
1.8
2.1
3.0
ns
tRD3
FO=3 Routing Delay
1.8
2.0
2.3
2.7
3.8
ns
tRD4
FO=4 Routing Delay
2.2
2.4
2.7
3.2
4.5
ns
tRD8
FO=8 Routing Delay
3.6
4.0
4.5
5.3
7.5
ns
Logic Module Sequential Timing3, 4
tSUD
Flip-Flop (Latch) Data Input Set-Up
0.5
0.6
0.7
0.9
ns
tHD
Flip-Flop (Latch) Data Input Hold
0.0
ns
tSUENA
Flip-Flop (Latch) Enable Set-Up
1.0
1.1
1.2
1.4
2.0
ns
tHENA
Flip-Flop (Latch) Enable Hold
0.0
ns
tWCLKA
Flip-Flop (Latch) Clock Active
Pulse Width
4.8
5.3
6.0
7.1
9.9
ns
tWASYN
Flip-Flop (Latch) Asynchronous
Pulse Width
6.2
6.9
7.9
9.2
12.9
ns
tA
Flip-Flop Clock Input Period
9.5
10.6
12.0
14.1
19.8
ns
tINH
Input Buffer Latch Hold
0.0
ns
tINSU
Input Buffer Latch Set-Up
0.7
0.8
0.9
1.01
1.4
ns
tOUTH
Output Buffer Latch Hold
0.0
ns
tOUTSU
Output Buffer Latch Set-Up
0.7
0.8
0.89
1.01
1.4
ns
fMAX
Flip-Flop (Latch) Clock Frequency
129
117
108
94
56
MHz
Notes:
1. For dual-module macros use tPD1 + tRD1 + taped, to + tRD1 + taped, or tPD1 + tRD1 + tusk, whichever is appropriate.
2. Routing delays are for typical designs across worst-case operating conditions. These parameters should be used for estimating
device performance. Post-route timing analysis or simulation is required to determine actual performance.
3. Data applies to macros based on the S-module. Timing parameters for sequential macros constructed from C-modules can be
obtained from the Timer utility.
4. Set-up and hold timing parameters for the input buffer latch are defined with respect to the PAD and the D input. External setup/
hold timing parameters must account for delay from an external PAD signal to the G inputs. Delay from an external PAD signal to
the G input subtracts (adds) to the internal setup (hold) time.
5. Delays based on 35 pF loading.
相關PDF資料
PDF描述
A40MX04-1PQ100I FPGA, 547 CLBS, 6000 GATES, 92 MHz, PQFP100
A40MX04-1PQ100MX79 FPGA, 547 CLBS, 6000 GATES, 92 MHz, PQFP100
A40MX04-1PQ100M FPGA, 547 CLBS, 6000 GATES, 92 MHz, PQFP100
A40MX04-1PQ100X79 FPGA, 547 CLBS, 6000 GATES, 92 MHz, PQFP100
A40MX04-1PQ100 FPGA, 547 CLBS, 6000 GATES, 92 MHz, PQFP100
相關代理商/技術參數
參數描述
A40MX04-1PQ100M 制造商:Microsemi Corporation 功能描述:FPGA 40MX Family 6K Gates 547 Cells 96MHz/160MHz 0.45um Technology 3.3V/5V 100-Pin PQFP 制造商:Microsemi Corporation 功能描述:FPGA 6K GATES 547 CELLS 96MHZ/160MHZ 0.45UM 3.3V/5V 100PQFP - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 69 I/O 100PQFP
A40MX04-1PQG100 功能描述:IC FPGA MX SGL CHIP 6K 100-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現場可編程門陣列) 系列:MX 標準包裝:90 系列:ProASIC3 LAB/CLB數:- 邏輯元件/單元數:- RAM 位總計:36864 輸入/輸出數:157 門數:250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA(17x17)
A40MX04-1PQG100I 功能描述:IC FPGA MX SGL CHIP 6K 100-PQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現場可編程門陣列) 系列:MX 標準包裝:90 系列:ProASIC3 LAB/CLB數:- 邏輯元件/單元數:- RAM 位總計:36864 輸入/輸出數:157 門數:250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA(17x17)
A40MX04-1PQG100M 制造商:Microsemi Corporation 功能描述:FPGA 6K GATES 547 CELLS 96MHZ/160MHZ 0.45UM 3.3V/5V 100PQFP - Trays 制造商:Microsemi Corporation 功能描述:IC FPGA 69 I/O 100PQFP
A40MX04-1VQ80 功能描述:IC FPGA MX SGL CHIP 6K 80-VQFP RoHS:否 類別:集成電路 (IC) >> 嵌入式 - FPGA(現場可編程門陣列) 系列:MX 標準包裝:90 系列:ProASIC3 LAB/CLB數:- 邏輯元件/單元數:- RAM 位總計:36864 輸入/輸出數:157 門數:250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA(17x17)
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