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參數資料
型號: A40MX04-3PL84X79
元件分類: FPGA
英文描述: FPGA, 547 CLBS, 6000 GATES, 109 MHz, PQCC84
封裝: PLASTIC, LCC-84
文件頁數: 24/124頁
文件大小: 3142K
代理商: A40MX04-3PL84X79
40MX and 42MX FPGA Families
1- 6
v6.1
MultiPlex I/O Modules
42MX devices feature Multiplex I/Os and support 5.0V,
3.3V, and mixed 3.3V/5.0V operations.
The MultiPlex I/O modules provide the interface between
the device pins and the logic array. Figure 1-9 is a block
diagram of the 42MX I/O module. A variety of user
functions, determined by a library macro selection, can
be implemented in the module. (Refer to the Antifuse
Macro Library Guide for more information.) All 42MX I/O
modules contain tristate buffers, with input and output
latches that can be configured for input, output, or
bidirectional operation.
All 42MX devices contain flexible I/O structures, where
each output pin has a dedicated output-enable control
(Figure 1-9). The I/O module can be used to latch input or
output data, or both, providing fast set-up time. In
addition, the Actel Designer software tools can build a D-
type flip-flop using a C-module combined with an I/O
module to register input and output signals. Refer to the
A42MX24 and A42MX36 devices also offer selectable PCI
output drives, enabling 100% compliance with version
2.1 of the PCI specification. For low-power systems, all
inputs and outputs are turned off to reduce current
consumption to below 500
μA.
To achieve 5.0V or 3.3V PCI-compliant output drives on
A42MX24 and A42MX36 devices, a chip-wide PCI fuse is
programmed via the Device Selection Wizard in the
Designer software (Figure 1-10). When the PCI fuse is not
programmed, the output drive is standard.
Actel's Designer software development tools provide a
design library of I/O macro functions that can implement
all I/O configurations supported by the MX FPGAs.
Other Architectural Features
Performance
MX devices can operate with internal clock frequencies
of 250 MHz, enabling fast execution of complex logic
functions. MX devices are live on power-up and do not
require auxiliary configuration devices and thus are an
optimal
platform
to
integrate
the
functionality
contained in multiple programmable logic devices. In
addition, designs that previously would have required a
gate array to meet performance can be integrated into
an MX device with improvements in cost and time-to-
market. Using timing-driven place-and-route (TDPR)
tools, designers can achieve highly deterministic device
performance.
User Security
The Actel FuseLock provides robust security against
design theft. Special security fuses are hidden in the
fabric of the device and prevent unauthorized users from
accessing the programming and/or probe interfaces. It is
virtually impossible to identify or bypass these fuses
without damaging the device, making Actel antifuse
FPGAs immune to both invasive and noninvasive attacks.
Special security fuses in 40MX devices include the Probe
Fuse and Program Fuse. The former disables the probing
circuitry while the latter prohibits further programming
of all fuses, including the Probe Fuse. In 42MX devices,
there is the Security Fuse which, when programmed,
both disables the probing circuitry and prohibits further
programming of the device.
Look for this symbol to ensure your valuable IP is secure.
For more information, refer to
Note: *Can be configured as a Latch or D Flip-Flop (Using
C-Module)
Figure 1-9 42MX I/O Module
Q
D
From Array
To Array
G/CLK*
Q
D
PAD
EN
Figure 1-10 PCI Output Structure of A42MX24 and
A42MX36 Devices
Signal
PCI Enable
PCI
Fuse
Drive
STD
Output
相關PDF資料
PDF描述
A40MX04-3PL84 FPGA, 547 CLBS, 6000 GATES, 109 MHz, PQCC84
A40MX04-3PQ100IX79 FPGA, 547 CLBS, 6000 GATES, 109 MHz, PQFP100
A40MX04-3PQ100I FPGA, 547 CLBS, 6000 GATES, 109 MHz, PQFP100
A40MX04-3PQ100X79 FPGA, 547 CLBS, 6000 GATES, 109 MHz, PQFP100
A40MX04-3PQ100 FPGA, 547 CLBS, 6000 GATES, 109 MHz, PQFP100
相關代理商/技術參數
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A40MX04-3PLG68I 功能描述:IC FPGA MX SGL CHIP 6K 68-PLCC RoHS:是 類別:集成電路 (IC) >> 嵌入式 - FPGA(現場可編程門陣列) 系列:MX 標準包裝:90 系列:ProASIC3 LAB/CLB數:- 邏輯元件/單元數:- RAM 位總計:36864 輸入/輸出數:157 門數:250000 電源電壓:1.425 V ~ 1.575 V 安裝類型:表面貼裝 工作溫度:-40°C ~ 125°C 封裝/外殼:256-LBGA 供應商設備封裝:256-FPBGA(17x17)
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