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參數資料
| 型號： | AD7689 |
| 廠商： | Analog Devices, Inc. |
| 英文描述： | 16-Bit, 8-Channel, 250 kSPS PulSAR㈢ ADC. |
| 中文描述： | 16位，8通道，250 kSPS的PulSAR系列㈢ADC的。 |
| 文件頁數： | 19/20頁 |
| 文件大小： | 2041K |
| 代理商： | AD7689 |
Preliminary Technical Data
AD7689
APPLICATION HINTS
LAYOUT
The printed circuit board that houses the AD7689 should be
designed so that the analog and digital sections are separated
and confined to certain areas of the board. The pinout of the
AD7689, with all its analog signals on the left side and all its
digital signals on the right side, eases this task.
Avoid running digital lines under the device because these
couple noise onto the die unless a ground plane under the
AD7689 is used as a shield. Fast switching signals, such as CNV
or clocks, should not run near analog signal paths. Crossover of
digital and analog signals should be avoided.
At least one ground plane should be used. It could be common
or split between the digital and analog sections. In the latter
case, the planes should be joined underneath the AD7689s.
The AD7689 voltage reference input REF has a dynamic input
impedance and should be decoupled with minimal parasitic
inductances. This is done by placing the reference decoupling
ceramic capacitor close to, ideally right up against, the REF and
GND pins and connecting them with wide, low impedance traces.
Finally, the power supplies VDD and VIO of the AD7689
should be decoupled with ceramic capacitors, typically 100 nF,
placed close to the AD7689 and connected using short, wide
traces to provide low impedance paths and reduce the effect of
glitches on the power supply lines.
An example of a layout following these rules is shown in
Figure 21 and Figure 22.
EVALUATING AD7689 PERFORMANCE
Other recommended layouts for the AD7689 are outlined
in the documentation of the evaluation board for the AD7689
(
EVAL-AD7689CBZ
). The evaluation board package includes
a fully assembled and tested evaluation board, documentation,
and software for controlling the board from a PC via the
EVAL-CONTROL BRD3Z
.
Rev. PrC | Page 19 of 20
Figure 21. Example Layout of the AD7689 (Top Layer)
Figure 22. Example Layout of the AD7689 (Bottom Layer)
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相關代理商/技術參數 |
參數描述 |
|---|---|
| AD7689ACPZ | 功能描述:IC ADC 16BIT 250KSPS 8CH 20LFCSP RoHS:是 類別:集成電路 (IC) >> 數據采集 - 模數轉換器 系列:PulSAR® 標準包裝:1 系列:microPOWER™ 位數:8 采樣率（每秒）:1M 數據接口:串行，SPI? 轉換器數目:1 功率耗散（最大）:- 電壓電源:模擬和數字 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:24-VFQFN 裸露焊盤 供應商設備封裝:24-VQFN 裸露焊盤（4x4） 包裝:Digi-Reel® 輸入數目和類型:8 個單端，單極 產品目錄頁面:892 (CN2011-ZH PDF) 其它名稱:296-25851-6 |
| AD7689ACPZRL7 | 功能描述:IC ADC 16BIT 250KSPS 8CH 20LFCSP RoHS:是 類別:集成電路 (IC) >> 數據采集 - 模數轉換器 系列:PulSAR® 標準包裝:1,000 系列:- 位數:16 采樣率（每秒）:45k 數據接口:串行 轉換器數目:2 功率耗散（最大）:315mW 電壓電源:模擬和數字 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:28-SOIC（0.295"，7.50mm 寬） 供應商設備封裝:28-SOIC W 包裝:帶卷 (TR) 輸入數目和類型:2 個單端，單極 |
| AD7689BCBZ-RL7 | 功能描述:16 Bit Analog to Digital Converter 8 Input 1 SAR 20-WLCSP (2.39x2.39) 制造商:analog devices inc. 系列:- 包裝:剪切帶（CT） 零件狀態:有效 位數:16 采樣率（每秒）:250k 輸入數:8 輸入類型:差分，個偽差分，單端 數據接口:SPI，DSP 配置:MUX-S/H-ADC 無線電 - S/H:ADC:1:1 A/D 轉換器數:1 架構:SAR 參考類型:外部， 內部 電壓 - 電源，模擬:2.3 V ~ 5.5 V 電壓 - 電源，數字:1.8 V ~ 5.5 V 特性:溫度傳感器 工作溫度:-40°C ~ 85°C 封裝/外殼:20-UFBGA，WLCSP 供應商器件封裝:20-WLCSP（2.39x2.39） 標準包裝:1 |
| AD7689BCPZ | 功能描述:IC ADC 16BIT 250KSPS 8CH 20LFCSP RoHS:是 類別:集成電路 (IC) >> 數據采集 - 模數轉換器 系列:PulSAR® 標準包裝:1 系列:microPOWER™ 位數:8 采樣率（每秒）:1M 數據接口:串行，SPI? 轉換器數目:1 功率耗散（最大）:- 電壓電源:模擬和數字 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:24-VFQFN 裸露焊盤 供應商設備封裝:24-VQFN 裸露焊盤（4x4） 包裝:Digi-Reel® 輸入數目和類型:8 個單端，單極 產品目錄頁面:892 (CN2011-ZH PDF) 其它名稱:296-25851-6 |
| AD7689BCPZ | 制造商:Analog Devices 功能描述:IC ADC 16BIT 250KSPS LFCSP-20 |
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