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參數(shù)資料
| 型號： | AD7862AR-10 |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | ADC |
| 英文描述： | Simultaneous Sampling Dual 250 kSPS 12-Bit ADC |
| 中文描述： | 2-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PDSO28 |
| 封裝： | SOIC-28 |
| 文件頁數(shù)： | 3/16頁 |
| 文件大?。?/td> | 414K |
| 代理商： | AD7862AR-10 |
–3–
REV. 0
AD7862
A
Version
1
B
Version
S
Version
Parameter
Units
Test Conditions/Comments
LOGIC OUTPUTS
Output High Voltage, V
OH
Output Low Voltage, V
OL
DB11–DB0
Floating-State Leakage Current
Floating-State Capacitance
4
Output Coding
AD7862-10, AD7862-3
AD7863-2
4.0
0.4
4.0
0.4
4.0
0.4
V min
V max
I
SOURCE
= 200
μ
A
I
SINK
= 1.6 mA
±
10
10
±
10
10
±
10
10
μ
A max
pF max
Twos Complement
Straight (Natural) Binary
CONVERSION RATE
Conversion Time
Track/Hold Acquisition Time
2, 3
3.6
0.3
3.6
0.3
3.6
0.3
μ
s max
μ
s max
For Both Channels
POWER REQUIREMENTS
V
DD
+5
+5
+5
V nom
±
5% for Specified Performance
I
DD
Normal Mode
Standby Mode
Power Dissipation
Normal Mode
Standby Mode
15
25
15
25
15
25
mA max
μ
A max
Logic Inputs = 0 V or V
DD
75
125
75
125
75
125
mW max
μ
W max
Typically 60 mW
Typically 75
μ
W
NOTES
1
Temperature ranges are as follows: A, B Versions: –40
°
C to +85
°
C;
S Version: –55
°
C to +125
°
C.
2
Performance measured through full channel (multiplexer, SHA and ADC).
3
See Terminology.
ABSOLUTE MAXIMUM RATINGS*
(T
A
= +25
°
C unless otherwise noted)
V
DD
to AGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
V
DD
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±
0.3 V
Analog Input Voltage to AGND
AD7862-10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±
17 V
AD7862-3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±
7 V
AD7862-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7 V
Reference Input Voltage to AGND . . . –0.3 V to V
DD
+ 0.3 V
Digital Input Voltage to DGND . . . . . –0.3 V to V
DD
+ 0.3 V
Digital Output Voltage to DGND . . . . –0.3 V to V
DD
+ 0.3 V
Operating Temperature Range
Commercial (A, B Version) . . . . . . . . . . . –40
°
C to +85
°
C
Extended (S Version) . . . . . . . . . . . . . . . . –55
°
C to +125
°
C
Storage Temperature Range . . . . . . . . . . . . –65
°
C to +150
°
C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150
°
C
Plastic DIP Package, Power Dissipation . . . . . . . . . . 670 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 116
°
C/W
Lead Temperature, (Soldering 10 sec) . . . . . . . . . . +260
°
C
Ceramic DIP Package, Power Dissipation . . . . . . . . . 670 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 116
°
C/W
Lead Temperature, (Soldering 10 sec) . . . . . . . . . . +260
°
C
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 110
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . +215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220
°
C
SSOP Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 110
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . +215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220
°
C
*Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those listed in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ORDERING GUIDE
Input
Input
±
10 V
±
10 V
±
10 V
±
10 V
±
10 V
±
2.5 V
±
2.5 V
±
2.5 V
±
2.5 V
0 V to 2.5 V
0 V to 2.5 V
Relative
Accuracy
±
1 LSB
±
1 LSB
±
1 LSB
±
1 LSB
±
1 LSB
±
1 LSB
±
1 LSB
±
1 LSB
±
1 LSB
±
1 LSB
±
1 LSB
Temperature
Range
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–55
°
C to +125
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
Package
Description
Package
Option
Model
AD7862AR-10
AD7862BR-10
AD7862ARS-10
AD7862AN-10
AD7862SQ-10
AD7862AR-3
AD7862BR-3
AD7862ARS-3
AD7862AN-3
AD7862AR-2
AD7862ARS-2
28-Bit Small Outline Package
28-Bit Small Outline Package
28-Bit Shrink Small Outline Package
28-Bit Plastic DIP
28-Bit Cerdip
28-Bit Small Outline Package
28-Bit Small Outline Package
28-Bit Shrink Small Outline Package
28-Plastic DIP
28-Bit Small Outline Package
28-Bit Shrink Small Outline Package
R-28
R-28
RS-28
N-28
Q-28
R-28
R-28
RS-28
N-28
R-28
RS-28
4
Sample tested @ +25
°
C to ensure compliance.
Specifications subject to change without notice.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AD7862AR-10REEL | 制造商:Analog Devices 功能描述:ADC Dual SAR 250ksps 12-bit Parallel 28-Pin SOIC W T/R |
| AD7862AR-2 | 制造商:Analog Devices 功能描述:ADC Dual SAR 250ksps 12-bit Parallel 28-Pin SOIC W 制造商:Rochester Electronics LLC 功能描述:DUAL 12-BIT PARALLEL ADC I.C. - Bulk |
| AD7862AR-2REEL | 功能描述:IC ADC 12BIT DUAL 250KSPS 28SOIC RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 模數(shù)轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:- 位數(shù):12 采樣率（每秒）:300k 數(shù)據(jù)接口:并聯(lián) 轉(zhuǎn)換器數(shù)目:1 功率耗散（最大）:75mW 電壓電源:單電源 工作溫度:0°C ~ 70°C 安裝類型:表面貼裝 封裝/外殼:24-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:24-SOIC 包裝:帶卷 (TR) 輸入數(shù)目和類型:1 個單端，單極；1 個單端，雙極 |
| AD7862AR-3 | 制造商:Analog Devices 功能描述:ADC Dual SAR 250ksps 12-bit Parallel 28-Pin SOIC W 制造商:Rochester Electronics LLC 功能描述:DUAL 12-BIT PARALLEL ADC I.C. - Bulk 制造商:Analog Devices 功能描述:IC DUAL 12-BIT ADC ((NS)) |
| AD7862AR-3REEL | 制造商:Analog Devices 功能描述:ADC Dual SAR 250ksps 12-bit Parallel 28-Pin SOIC W T/R 制造商:Rochester Electronics LLC 功能描述:DUAL 12-BIT PARALLEL ADC I.C. - Tape and Reel |
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