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參數(shù)資料
型號(hào)： AD7862AR-2
廠商： ANALOG DEVICES INC
元件分類： ADC
英文描述： Simultaneous Sampling Dual 250 kSPS 12-Bit ADC
中文描述： 2-CH 12-BIT SUCCESSIVE APPROXIMATION ADC, PARALLEL ACCESS, PDSO28
封裝： SOIC-28
文件頁數(shù)： 3/16頁
文件大小： 414K
代理商： AD7862AR-2
–3–
REV. 0
AD7862
A
Version
1
B
Version
S
Version
Parameter
Units
Test Conditions/Comments
LOGIC OUTPUTS
Output High Voltage, V
OH
Output Low Voltage, V
OL
DB11–DB0
Floating-State Leakage Current
Floating-State Capacitance
4
Output Coding
AD7862-10, AD7862-3
AD7863-2
4.0
0.4
4.0
0.4
4.0
0.4
V min
V max
I
SOURCE
= 200
μ
A
I
SINK
= 1.6 mA
±
10
10
±
10
10
±
10
10
μ
A max
pF max
Twos Complement
Straight (Natural) Binary
CONVERSION RATE
Conversion Time
Track/Hold Acquisition Time
2, 3
3.6
0.3
3.6
0.3
3.6
0.3
μ
s max
μ
s max
For Both Channels
POWER REQUIREMENTS
V
DD
+5
+5
+5
V nom
±
5% for Specified Performance
I
DD
Normal Mode
Standby Mode
Power Dissipation
Normal Mode
Standby Mode
15
25
15
25
15
25
mA max
μ
A max
Logic Inputs = 0 V or V
DD
75
125
75
125
75
125
mW max
μ
W max
Typically 60 mW
Typically 75
μ
W
NOTES
1
Temperature ranges are as follows: A, B Versions: –40
°
C to +85
°
C;
S Version: –55
°
C to +125
°
C.
2
Performance measured through full channel (multiplexer, SHA and ADC).
3
See Terminology.
ABSOLUTE MAXIMUM RATINGS*
(T
A
= +25
°
C unless otherwise noted)
V
DD
to AGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
V
DD
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AGND to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±
0.3 V
Analog Input Voltage to AGND
AD7862-10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±
17 V
AD7862-3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±
7 V
AD7862-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +7 V
Reference Input Voltage to AGND . . . –0.3 V to V
DD
+ 0.3 V
Digital Input Voltage to DGND . . . . . –0.3 V to V
DD
+ 0.3 V
Digital Output Voltage to DGND . . . . –0.3 V to V
DD
+ 0.3 V
Operating Temperature Range
Commercial (A, B Version) . . . . . . . . . . . –40
°
C to +85
°
C
Extended (S Version) . . . . . . . . . . . . . . . . –55
°
C to +125
°
C
Storage Temperature Range . . . . . . . . . . . . –65
°
C to +150
°
C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . +150
°
C
Plastic DIP Package, Power Dissipation . . . . . . . . . . 670 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 116
°
C/W
Lead Temperature, (Soldering 10 sec) . . . . . . . . . . +260
°
C
Ceramic DIP Package, Power Dissipation . . . . . . . . . 670 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 116
°
C/W
Lead Temperature, (Soldering 10 sec) . . . . . . . . . . +260
°
C
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 110
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . +215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220
°
C
SSOP Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . 110
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . +215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . +220
°
C
*Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those listed in the
operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
ORDERING GUIDE
Input
Input
±
10 V
±
10 V
±
10 V
±
10 V
±
10 V
±
2.5 V
±
2.5 V
±
2.5 V
±
2.5 V
0 V to 2.5 V
0 V to 2.5 V
Relative
Accuracy
±
1 LSB
±
1 LSB
±
1 LSB
±
1 LSB
±
1 LSB
±
1 LSB
±
1 LSB
±
1 LSB
±
1 LSB
±
1 LSB
±
1 LSB
Temperature
Range
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–55
°
C to +125
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
Package
Description
Package
Option
Model
AD7862AR-10
AD7862BR-10
AD7862ARS-10
AD7862AN-10
AD7862SQ-10
AD7862AR-3
AD7862BR-3
AD7862ARS-3
AD7862AN-3
AD7862AR-2
AD7862ARS-2
28-Bit Small Outline Package
28-Bit Small Outline Package
28-Bit Shrink Small Outline Package
28-Bit Plastic DIP
28-Bit Cerdip
28-Bit Small Outline Package
28-Bit Small Outline Package
28-Bit Shrink Small Outline Package
28-Plastic DIP
28-Bit Small Outline Package
28-Bit Shrink Small Outline Package
R-28
R-28
RS-28
N-28
Q-28
R-28
R-28
RS-28
N-28
R-28
RS-28
4
Sample tested @ +25
°
C to ensure compliance.
Specifications subject to change without notice.
相關(guān)PDF資料
PDF描述
AD7862SQ-10 Simultaneous Sampling Dual 250 kSPS 12-Bit ADC
AD7862AR-3 Simultaneous Sampling Dual 250 kSPS 12-Bit ADC
AD7862ARS-10 Simultaneous Sampling Dual 250 kSPS 12-Bit ADC
AD7862ARS-2 Simultaneous Sampling Dual 250 kSPS 12-Bit ADC
AD7862ARS-3 Simultaneous Sampling Dual 250 kSPS 12-Bit ADC
相關(guān)代理商/技術(shù)參數(shù)
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