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參數(shù)資料
| 型號(hào)： | AD7922 |
| 廠商： | Analog Devices, Inc. |
| 英文描述： | 2-Channel, 2.35 V to 5.25 V, 1 MSPS, 10-/12-Bit ADCs |
| 中文描述： | 2通道，2.35 V至5.25 V，1 MSPS的，10-/12-Bit模數(shù)轉(zhuǎn)換器 |
| 文件頁(yè)數(shù)： | 28/32頁(yè) |
| 文件大小： | 386K |
| 代理商： | AD7922 |
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AD7912/AD7922
APPLICATION HINTS
GROUNDING AND LAYOUT
The printed circuit board that houses the AD7912/AD7922
should be designed such that the analog and digital sections are
separated and confined to certain areas of the board. This
facilitates the use of ground planes that can be separated easily.
A minimum etch technique is generally best for ground planes,
because it gives the best shielding. Digital and analog ground
planes should be joined at only one place. If the AD7912/
AD7922 are in a system where multiple devices require an
AGND-to-DGND connection, the connection should still be
made at one point only, a star ground point that should be
established as close as possible to the AD7912/AD7922.
Rev. 0 | Page 28 of 32
Avoid running digital lines under the device, because these
couple noise onto the die. The analog ground plane should be
allowed to run under the AD7912/AD7922 to avoid noise
coupling. The power supply lines to the AD7912/AD7922
should use as large a trace as possible to provide low impedance
paths and reduce the effects of glitches on the power supply line.
Fast-switching signals like clocks should be shielded with digital
ground to avoid radiating noise to other sections of the board,
and clock signals should never be run near the analog inputs.
Avoid crossover of digital and analog signals. Traces on opposite
sides of the board should run at right angles to each other to
reduce the effects of feedthrough through the board. A micro-
strip technique is by far the best, but is not always possible with
a double-sided board. In this technique, the component side of
the board is dedicated to ground planes, while signals are placed
on the solder side.
Good decoupling is also very important. The analog supply
should be decoupled with 10 μF tantalum in parallel with 0.1 μF
capacitors to AGND. To achieve the best performance from
these decoupling components, the user should endeavor to keep
the distance between the decoupling capacitor and the V
DD
and
GND pins to a minimum with short track lengths connecting
the respective pins.
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| AD7922ARM-REEL7 | 2-Channel, 2.35 V to 5.25 V, 1 MSPS, 10-/12-Bit ADCs |
| AD7923 | SHROUDED HEADER 60 PIN STRAIGHT |
| AD7923BRU | Four Wall Header; No. of Contacts:60; Pitch Spacing:0.1"; No. of Rows:2; Gender:Header; Body Material:Glass-filled Polyester; Contact Plating:Nickel; Leaded Process Compatible:No; Mounting Type:Through Hole RoHS Compliant: No |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AD7922ARM | 制造商:Analog Devices 功能描述:ADC Single SAR 1Msps 12-bit Serial 8-Pin MSOP 制造商:Rochester Electronics LLC 功能描述:DUAL 12-BIT, 1MSPS, ADC I.C - Bulk 制造商:Analog Devices 功能描述:12BIT ADC DUAL SMD 7922 MSOP8 |
| AD7922ARM-REEL | 制造商:Analog Devices 功能描述:ADC Single SAR 1Msps 12-bit Serial 8-Pin MSOP T/R 制造商:Analog Devices 功能描述:ADC SGL SAR 1MSPS 12-BIT SERL 8MSOP - Tape and Reel 制造商:Rochester Electronics LLC 功能描述:DUAL 10-BIT, 1MSPS, ADC I.C - Tape and Reel |
| AD7922ARM-REEL7 | 制造商:Analog Devices 功能描述:ADC Single SAR 1Msps 12-bit Serial 8-Pin MSOP T/R 制造商:Analog Devices 功能描述:ADC SGL SAR 1MSPS 12-BIT SERL 8MSOP - Tape and Reel 制造商:Rochester Electronics LLC 功能描述:DUAL 10-BIT, 1MSPS, ADC I.C - Tape and Reel |
| AD7922ARMZ | 功能描述:IC ADC 12BIT 1MSPS DUAL 8-MSOP RoHS:是 類(lèi)別:集成電路 (IC) >> 數(shù)據(jù)采集 - 模數(shù)轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:1 系列:microPOWER™ 位數(shù):8 采樣率（每秒）:1M 數(shù)據(jù)接口:串行，SPI? 轉(zhuǎn)換器數(shù)目:1 功率耗散（最大）:- 電壓電源:模擬和數(shù)字 工作溫度:-40°C ~ 125°C 安裝類(lèi)型:表面貼裝 封裝/外殼:24-VFQFN 裸露焊盤(pán) 供應(yīng)商設(shè)備封裝:24-VQFN 裸露焊盤(pán)（4x4） 包裝:Digi-Reel® 輸入數(shù)目和類(lèi)型:8 個(gè)單端，單極 產(chǎn)品目錄頁(yè)面:892 (CN2011-ZH PDF) 其它名稱(chēng):296-25851-6 |
| AD7922ARMZ-REEL | 功能描述:IC ADC DUAL 12BIT 2CH 8MSOP RoHS:是 類(lèi)別:集成電路 (IC) >> 數(shù)據(jù)采集 - 模數(shù)轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:- 位數(shù):16 采樣率（每秒）:45k 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:2 功率耗散（最大）:315mW 電壓電源:模擬和數(shù)字 工作溫度:0°C ~ 70°C 安裝類(lèi)型:表面貼裝 封裝/外殼:28-SOIC（0.295"，7.50mm 寬） 供應(yīng)商設(shè)備封裝:28-SOIC W 包裝:帶卷 (TR) 輸入數(shù)目和類(lèi)型:2 個(gè)單端，單極 |
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