- 您現在的位置：買賣IC網 > PDF目錄373929 > AD8027AR (ANALOG DEVICES INC) Low Distortion, High Speed Rail-to-Rail Input/Output Amplifiers PDF資料下載
參數資料
| 型號： | AD8027AR |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | Low Distortion, High Speed Rail-to-Rail Input/Output Amplifiers |
| 中文描述： | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| 封裝： | MS-012AA, SOIC-8 |
| 文件頁數： | 6/24頁 |
| 文件大小： | 478K |
| 代理商： | AD8027AR |
AD8027/AD8028
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Supply Voltage
Power Dissipation
Common-Mode Input Voltage
Differential Input Voltage
Storage Temperature
Operating Temperature Range
Lead Temperature Range
(Soldering 10 sec)
Junction Temperature
Rev. B | Page 6 of 24
Rating
12.6 V
See Figure 3
±V
S
± 0.5 V
±1.8 V
–65°C to +125°C
–40°C to +125°C
300°C
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress rat-
ing only; functional operation of the device at these or any
other conditions above those indicated in the operational sec-
tion of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Maximum Power Dissipation
The maximum safe power dissipation in the AD8027/AD8028
package is limited by the associated rise in junction temperature
(T
J
) on the die. The plastic encapsulating the die will locally
reach the junction temperature. At approximately 150°C, which
is the glass transition temperature, the plastic will change its
properties. Even temporarily exceeding this temperature limit
may change the stresses that the package exerts on the die,
permanently shifting the parametric performance of the
AD8027/AD8028. Exceeding a junction temperature of 175°C
for an extended period of time can result in changes in the
silicon devices, potentially causing failure.
The still-air thermal properties of the package and PCB (θ
JA
),
ambient temperature (T
A
), and the total power dissipated in the
package (P
D
) determine the junction temperature of the die.
The junction temperature can be calculated as
(
)
JA
D
A
J
θ
P
T
T
×
+
=
The power dissipated in the package (P
D
) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power is the voltage between the supply pins (V
S
) times the
quiescent current (I
S
). Assuming the load (R
L
) is referenced to
midsupply, then the total drive power is V
S
/2 × I
OUT
, some of
which is dissipated in the package and some in the load (V
OUT
×
I
OUT
). The difference between the total drive power and the load
power is the drive power dissipated in the package.
(
)
Power
Load
–
Power
Drive
Total
Power
Quiescent
P
D
+
=
(
V
)
L
OUT
R
L
OUT
R
S
S
S
D
V
V
V
I
P
2
–
2
×
+
×
=
RMS output voltages should be considered. If R
L
is referenced
to V
S–
, as in single-supply operation, then the total drive power
is V
S
× I
OUT
.
If the rms signal levels are indeterminate, then consider the
worst case, when V
OUT
= V
S
/4 for R
L
to midsupply
(
)
(
)
L
S
R
S
S
D
V
I
V
P
2
4
+
×
=
In single-supply operation with R
L
referenced to V
S
–, worst case
is V
OUT
= V
S
/2.
Airflow will increase heat dissipation, effectively reducing θ
JA
.
Also, more metal directly in contact with the package leads
from metal traces, through holes, ground, and power planes will
reduce the θ
JA
. Care must be taken to minimize parasitic capaci-
tances at the input leads of high speed op amps as discussed in
the board layout section.
Figure 3 shows the maximum safe power dissipation in the
package versus the ambient temperature for the SOIC-8
(125°C/W), SOT-23-6 (170°C/W), and MSOP-10 (130°C/W)
packages on a JEDEC standard 4-layer board.
OUTPUT SHORT CIRCUIT
Shorting the output to ground or drawing excessive current
from the AD8027/AD8028 will likely cause catastrophic failure.
AMBIENT TEMPERATURE (°C)
M
–55
–35
–15
5
25
45
65
85
105
125
0
0.5
1.0
1.5
2.0
SOT-23-6
SOIC-8
MSOP-10
03327-A-002
Figure 3. Maximum Power Dissipation
相關PDF資料 |
PDF描述 |
|---|---|
| AD8027AR-REEL | Low Distortion, High Speed Rail-to-Rail Input/Output Amplifiers |
| AD8027AR-REEL7 | Low Distortion, High Speed Rail-to-Rail Input/Output Amplifiers |
| AD8027ART-R2 | Low Distortion, High Speed Rail-to-Rail Input/Output Amplifiers |
| AD8027ART-REEL | Low Distortion, High Speed Rail-to-Rail Input/Output Amplifiers |
| AD8027ART-REEL7 | Low Distortion, High Speed Rail-to-Rail Input/Output Amplifiers |
相關代理商/技術參數 |
參數描述 |
|---|---|
| AD8027AR-EBZ | 功能描述:BOARD EVAL FOR AD8027AR RoHS:是 類別:編程器，開發系統 >> 評估板 - 運算放大器 系列:- 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:1 系列:- |
| AD8027AR-REEL | 制造商:Analog Devices 功能描述:OP Amp Single GP R-R I/O 制造商:Rochester Electronics LLC 功能描述:SOIC, SINGLE LOW-PWR VLTG-FDBK OP AMP - Tape and Reel |
| AD8027AR-REEL7 | 制造商:Analog Devices 功能描述:OP Amp Single GP R-R I/O 制造商:Analog Devices 功能描述:OP Amp Single GP R-R I/O ±6V/12V 8-Pin SOIC N T/R 制造商:Rochester Electronics LLC 功能描述:HIGH SPEED, RAIL-TO-RAIL IN/OUT OP-AMP - Tape and Reel |
| AD8027ART-EBZ | 功能描述:BOARD EVAL FOR AD8027ART RoHS:是 類別:編程器，開發系統 >> 評估板 - 運算放大器 系列:- 產品培訓模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標準包裝:1 系列:- |
| AD8027ART-R2 | 功能描述:IC OPAMP R-R LDIST LN LP SOT23-6 RoHS:否 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標準包裝:2,500 系列:- 放大器類型:通用 電路數:1 輸出類型:滿擺幅 轉換速率:0.11 V/µs 增益帶寬積:350kHz -3db帶寬:- 電流 - 輸入偏壓:4nA 電壓 - 輸入偏移:20µV 電流 - 電源:260µA 電流 - 輸出 / 通道:20mA 電壓 - 電源，單路/雙路(±):2.7 V ~ 36 V，±1.35 V ~ 18 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:8-SOIC（0.154"，3.90mm 寬） 供應商設備封裝:8-SO 包裝:帶卷 (TR) |
發布緊急采購，3分鐘左右您將得到回復。