
AD8036/AD8037
REV. A
–3–
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although these devices feature proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
ABSOLUTE MAXIMUM RATINGS
1
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.6 V
Voltage Swing
×
Bandwidth Product . . . . . . . . . . . 350 V-MHz
|V
H
–V
IN
| . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
≤
6.3 V
|V
L
–V
IN
| . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
≤
6.3 V
Internal Power Dissipation
2
Plastic DIP Package (N) . . . . . . . . . . . . . . . . . . . . 1.3 Watts
Small Outline Package (SO) . . . . . . . . . . . . . . . . . . 0.9 Watts
Input Voltage (Common Mode) . . . . . . . . . . . . . . . . . . . .
±
V
S
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . .
±
1.2 V
Output Short Circuit Duration
. . . . . . . . . . . . . . . . . . . . . . Observe Power Derating Curves
Storage Temperature Range N, R . . . . . . . . .–65
°
C to +125
°
C
Operating Temperature Range (A Grade) . . . –40
°
C to +85
°
C
Lead Temperature Range (Soldering 10 sec) . . . . . . . . +300
°
C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
Specification is for device in free air:
8-Lead Plastic DIP:
θ
= 90
°
C/W
8-Lead SOIC:
θ
JA
= 155
°
C/W
8-Lead Cerdip:
θ
JA
= 110
°
C/W.
METALIZATION PHOTO
Dimensions shown in inches and (mm).
Connect Substrate to –V
S
.
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by these de-
vices is limited by the associated rise in junction temperature.
The maximum safe junction temperature for plastic encapsu-
lated devices is determined by the glass transition temperature
of the plastic, approximately +150
°
C. Exceeding this limit tem-
porarily may cause a shift in parametric performance due to a
change in the stresses exerted on the die by the package. Exceed-
ing a junction temperature of +175
°
C for an extended period can
result in device failure.
While the AD8036 and AD8037 are internally short circuit pro-
tected, this may not be sufficient to guarantee that the maxi-
mum junction temperature (+150
°
C) is not exceeded under all
conditions. To ensure proper operation, it is necessary to ob-
serve the maximum power derating curves.
2.0
0
–50
80
1.5
0.5
–40
1.0
0
10
–10
AMBIENT TEMPERATURE –
8
C
–20
–30
20 30
40
50
60
70
90
M
T
J
= +150
8
C
8-LEAD PLASTIC DIP
PACKAGE
8-LEAD SOIC
PACKAGE
Figure 2. Plot of Maximum Power Dissipation vs.
Temperature
AD8036
8036
AD8037
8037
+IN
–V
S
OUT
–IN
+V
S
V
H
V
L
+IN
–V
S
OUT
–IN
+V
S
V
H
V
L
4
5
3
2
8
7
2
8
7
6
6
3
4
5
0.050 (1.27)
0.046
(1.17)
0.050 (1.27)
0.046
(1.17)
ORDERING GUIDE
Temperature
Range
Package
Description
Package
Option
Model
AD8036AN
AD8036AR
AD8036AR-REEL
AD8036AR-REEL7 –40
°
C to +85
°
C
AD8036ACHIPS
AD8036-EB
5962-9559701MPA –55
°
C to +125
°
C Cerdip
AD8037AN
–40
°
C to +85
°
C
AD8037AR
–40
°
C to +85
°
C
AD8037AR-REEL
–40
°
C to +85
°
C
AD8037AR-REEL7 –40
°
C to +85
°
C
AD8037ACHIPS
–40
°
C to +85
°
C
AD8037-EB
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
Plastic DIP
SOIC
13" Tape and Reel
7" Tape and Reel
Die
Evaluation Board
N-8
SO-8
SO-8
SO-8
–40
°
C to +85
°
C
Q-8
Plastic DIP
SOIC
13" Tape and Reel
7" Tape and Reel
Die
Evaluation Board
N-8
SO-8
SO-8
SO-8
WARNING!
ESD SENSITIVE DEVICE