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參數資料
| 型號： | AD8132ARZ |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | 音頻／視頻放大 |
| 英文描述： | Low Cost, High Speed Differential Amplifier |
| 中文描述： | 1 CHANNEL, VIDEO AMPLIFIER, PDSO8 |
| 封裝： | ROHS COMPLIANT, MS-012AA, SOIC-8 |
| 文件頁數： | 8/32頁 |
| 文件大小： | 456K |
| 代理商： | AD8132ARZ |
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AD8132
ABSOLUTE MAXIMUM RATINGS
Table 7.
Parameter
Supply Voltage
V
OCM
Internal Power Dissipation
Operating Temperature Range
Storage Temperature Range
Lead Temperature (Soldering 10 sec)
Junction Temperature
Rev. F | Page 8 of 32
Rating
±5.5 V
±V
S
250 mW
40°C to +125°C
65°C to +150°C
300°C
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, θ
JA
is
specified for the device soldered in a circuit board in still air.
Table 8.
Package Type
8-Lead SOIC/4-Layer
8-Lead MSOP/4-Layer
θ
JA
121
142
Unit
°C/W
°C/W
Maximum Power Dissipation
The maximum safe power dissipation in the AD8132 packages
is limited by the associated rise in junction temperature (T
J
) on
the die. At approximately 150°C (the glass transition temperature),
the plastic changes its properties. Even temporarily exceeding
this temperature limit can change the stresses that the package
exerts on the die, permanently shifting the parametric performance
of the AD8132. Exceeding a junction temperature of 150°C for
an extended period can result in changes in the silicon devices,
potentially causing failure.
The power dissipated in the package (P
D
) is the sum of the
quiescent power dissipation and the power dissipated in the
package due to the load drive for all outputs. The quiescent
power is the voltage between the supply pins (V
S
) times the
quiescent current (I
S
). The load current consists of the dif-
ferential and common-mode currents flowing to the load, as
well as currents flowing through the external feedback net-
works and the internal common-mode feedback loop. The
internal resistor tap used in the common-mode feedback loop
places a 1 kΩ differential load on the output. Consider rms
voltages and currents when dealing with ac signals.
Airflow reduces θ
JA
. In addition, more metal directly in contact
with the package leads from metal traces through holes, ground,
and power planes reduces the θ
JA
.
Figure 3 shows the maximum safe power dissipation in the
package vs. the ambient temperature for the 8-lead SOIC_N
(θ
JA
= 121°C/W) and MSOP (θ
JA
= 142°C/W) packages on a
JEDEC standard 4-layer board. θ
JA
values are approximations.
AMBIENT TEMPERATURE (°C)
M
1.75
1.50
1.00
1.25
0.50
0.25
0.75
0
–40–30 –20 –10 0
10 20 30 40 50 60 70 80 90 100 110120
SOIC
MSOP
0
Figure 3. Maximum Power Dissipation vs. Temperature
ESD CAUTION
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相關代理商/技術參數 |
參數描述 |
|---|---|
| AD8132ARZ1 | 制造商:AD 制造商全稱:Analog Devices 功能描述:Low Cost, High Speed Differential Amplifier |
| AD8132ARZ-R7 | 功能描述:IC AMP DIFF LDIST LP 70MA 8SOIC RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標準包裝:1 系列:- 放大器類型:通用 電路數:4 輸出類型:滿擺幅 轉換速率:0.6 V/µs 增益帶寬積:1MHz -3db帶寬:- 電流 - 輸入偏壓:2pA 電壓 - 輸入偏移:1000µV 電流 - 電源:85µA 電流 - 輸出 / 通道:20mA 電壓 - 電源，單路/雙路(±):1.8 V ~ 6 V 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:14-SOIC（0.154"，3.90mm 寬） 供應商設備封裝:14-SOICN 包裝:剪切帶 (CT) 產品目錄頁面:680 (CN2011-ZH PDF) 其它名稱:MCP6L04T-E/SLCT |
| AD8132ARZ-R71 | 制造商:AD 制造商全稱:Analog Devices 功能描述:Low Cost, High Speed Differential Amplifier |
| AD8132ARZ-REEL7 | 制造商:AD 制造商全稱:Analog Devices 功能描述:Low Cost, High Speed Differential Amplifier |
| AD8132ARZ-RL | 功能描述:IC AMP DIFF LDIST LP 70MA 8SOIC RoHS:是 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標準包裝:50 系列:- 放大器類型:通用 電路數:2 輸出類型:滿擺幅 轉換速率:1.8 V/µs 增益帶寬積:6.5MHz -3db帶寬:4.5MHz 電流 - 輸入偏壓:5nA 電壓 - 輸入偏移:100µV 電流 - 電源:65µA 電流 - 輸出 / 通道:35mA 電壓 - 電源，單路/雙路(±):1.8 V ~ 5.25 V，±0.9 V ~ 2.625 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:10-TFSOP，10-MSOP（0.118"，3.00mm 寬） 供應商設備封裝:10-MSOP 包裝:管件 |
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