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參數(shù)資料
| 型號： | AD815ARB-24 |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | 通用總線功能 |
| 英文描述： | ER 3C 3#12 SKT RECP |
| 中文描述： | LINE DRIVER, PDSO24 |
| 封裝： | THERMALLY ENHANCED, SOIC-24 |
| 文件頁數(shù)： | 11/16頁 |
| 文件大小： | 333K |
| 代理商： | AD815ARB-24 |
AD815
REV. B
–11–
DC ERRORS AND NOISE
There are three major noise and offset terms to consider in
a current feedback amplifier. For offset errors refer to the
equation below. For noise error the terms are root-sum-squared
to give a net output error. In the circuit below (Figure 42), they
are input offset (V
IO
) which appears at the output multiplied by
the noise gain of the circuit (1 + R
F
/R
G
), noninverting input
current (I
BN
×
R
N
) also multiplied by the noise gain, and the
inverting input current, which when divided between R
F
and R
G
and subsequently multiplied by the noise gain always appear at
the output as I
BI
×
R
F
. The input voltage noise of the AD815 is
less than 2 nV/
√
Hz
. At low gains though, the inverting input
current noise times R
F
is the dominant noise source. Careful
layout and device matching contribute to better offset and
drift specifications for the AD815 compared to many other
current feedback amplifiers. The typical performance curves
in conjunction with the equations below can be used to predict
the performance of the AD815 in any application.
V
OUT
=
V
IO
×
1
+
R
F
R
G
±
I
BN
×
R
N
×
1
+
R
F
R
G
±
I
BI
×
R
F
I
BI
I
BN
R
G
R
N
R
F
V
OUT
Figure 42. Output Offset Voltage
POWER CONSIDERATIONS
The 500 mA drive capability of the AD815 enables it to drive
a 50
load at 40V p-p when it is configured as a differential
driver. This implies a power dissipation, P
IN
, of nearly 5 watts.
To ensure reliability, the junction temperature of the AD815
should be maintained at less than 175
°
C. For this reason,
the AD815 will require some form of heat sinking in most
applications. The thermal diagram of Figure 43 gives the
basic relationship between junction temperature (T
J
) and
various components of
θ
JA
.
T
T
P
A
IN
A
J
J
=
+
θ
Equation 1
θ
A
(JUNCTION TO
DIE MOUNT)
θ
B
(DIE MOUNT
TO CASE)
θ
A
+
θ
B
=
θ
JC
CASE
T
A
T
J
θ
JC
θ
CA
T
A
θ
JA
T
J
P
IN
WHERE:
P
IN
= DEVICE DISSIPATION
T
A
= AMBIENT TEMPERATURE
T
J
= JUNCTION TEMPERATURE
θ
JC
= THERMAL RESISTANCE – JUNCTION TO CASE
θ
CA
= THERMAL RESISTANCE – CASE TO AMBIENT
Figure 43. A Breakdown of Various Package Thermal
Resistances
Figure 44 gives the relationship between output voltage swing
into various loads and the power dissipated by the AD815 (P
IN
).
This data is given for both sine wave and square wave (worst
case) conditions. It should be noted that these graphs are for
mostly resistive (phase <
±
10
°
) loads. When the power dissipation
requirements are known, Equation 1 and the graph on Figure 45
can be used to choose an appropriate heat sinking configuration.
4
3
P
I
10
20
30
40
2
1
V
OUT
– Volts p-p
R
L
= 50
V
R
L
= 100
V
R
L
= 200
V
f = 1kHz
SQUARE WAVE
SINE WAVE
Figure 44. Total Power Dissipation vs. Differential Output
Voltage
Normally, the AD815 will be soldered directly to a copper pad.
Figure 45 plots
θ
JA
against size of copper pad. This data pertains
to copper pads on both sides of G10 epoxy glass board connected
together with a grid of feedthroughs on 5 mm centers.
This data shows that loads of 100 ohms or less will usually not
require any more than this. This is a feature of the AD815’s
15-lead power SIP package.
An important component of
θ
JA
is the thermal resistance of the
package to heatsink. The data given is for a direct soldered
connection of package to copper pad. The use of heatsink
grease either with or without an insulating washer will increase
this number. Several options now exist for dry thermal connec-
tions. These are available from Bergquist as part # SP600-90.
Consult with the manufacturer of these products for details of
their application.
COPPER HEAT SINK AREA (TOP AND BOTTOM) – mm
2
Figure 45. Power Package Thermal Resistance vs. Heat
Sink Area
35
30
10
0
2.5k
0.5k
θ
J
8
C
1k
1.5k
2k
25
20
15
AD815AVR, AY
(θ
JC
= 2
8
C/W)
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| AD815 | SILICON DUAL DIFFERNTIAL AMPLIFIER TRANSISTORS |
| AD815ARB-24-REEL | High Output Current Differential Driver |
| AD815-EB | High Output Current Differential Driver |
| AD815AVR | High Output Current Differential Driver |
| AD815AY | High Output Current Differential Driver |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| AD815ARB-24-REEL | 制造商:Analog Devices 功能描述:ADSL Driver Dual 24-Pin SOIC W Bat T/R 制造商:Rochester Electronics LLC 功能描述:SOIC HIGH OUTPUT CURRENT DIFF DRIVER - Tape and Reel |
| AD815ARBZ-24 | 制造商:Analog Devices 功能描述:ADSL Driver Dual 24-Pin SOIC W Bat Tube 制造商:Analog Devices 功能描述:DIFF AMP RECEIVER HI SPEED 24SOIC |
| AD815ARBZ-24 | 制造商:Analog Devices 功能描述:OP-AMP No. of Amplifiers:2 |
| AD815ARBZ-24-REEL | 制造商:Analog Devices 功能描述:ADSL Driver Dual 24-Pin SOIC W Bat T/R 制造商:Analog Devices 功能描述:ADSL DRVR DUAL 24SOIC W BAT - Tape and Reel |
| AD815AVR | 制造商:Rochester Electronics LLC 功能描述:HIGH OUTPUT DIFF DRIVER - Bulk |
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