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參數(shù)資料
| 型號： | AD8188 |
| 廠商： | Analog Devices, Inc. |
| 英文描述： | 350 MHz Single-Supply (5 V) Triple 2:1 Multiplexers |
| 中文描述： | 350兆赫單電源（5V）的三重2:1多路復(fù)用器 |
| 文件頁數(shù)： | 5/24頁 |
| 文件大小： | 725K |
| 代理商： | AD8188 |
AD8188/AD8189
ABSOLUTE MAXIMUM RATINGS
Rev. 0 | Page 5 of 24
Table 2.
Parameter
1
Supply Voltage
DV
CC
to D
GND
DV
CC
to V
EE
V
CC
to D
GND
IN0A, IN0B, IN1A, IN1B, IN2A, IN2B, V
REF
SEL A/B, OE
Output Short-Circuit Operation
Operating Temperature Range
Storage Temperature Range
Lead Temperature Range (Soldering, 10 sec)
Rating
5.5 V
5.5 V
8.0 V
8.0 V
V
EE
≤ V
IN
≤ V
CC
D
GND
≤ V
IN
≤
V
CC
Indefinite
–40°C to +85°C
–65°C to +150°C
300°C
1
Specification is for device in free air (T
A
= 25°C).
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
24-Lead TSSOP
1
θ
JA2
85
θ
JC
20
Unit
°C/W
1
Maximum internal power dissipation (PD) should be derated for ambient
temperature (T
A
) such that PD < (150°C T
A
)/θ
JA
.
2
θ
JA
is on a 4-layer board (2s 2p).
MAXIMUM POWER DISSIPATION
The maximum safe junction temperature for plastic encapsulated
devices is determined by the glass transition temperature of the
plastic, approximately 150°C. Temporarily exceeding this limit
may cause a shift in parametric performance due to a change in
the stresses exerted on the die by the package. Exceeding a
junction temperature of 175°C for an extended period can
result in device failure.
While the AD8188/AD8189 is internally short circuit protected,
this may not be sufficient to guarantee that the maximum junction
temperature (150°C) is not exceeded under all conditions. To
ensure proper operation, it is necessary to observe the
maximum power derating curves shown in Figure 3.
2.5
2.0
1.5
1.0
0.5
0
–50 –40 –30 –20 –10
0
10
20
30
40
50
60
70
80
90
M
AMBIENT TEMPERATURE (°C)
0
Figure 3. Maximum Power Dissipation vs. Temperature
ESD CAUTION
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| AD8188ARUZ | 功能描述:IC MULTIPLEXER TRPL 2X1 24TSSOP RoHS:是 類別:集成電路 (IC) >> 接口 - 模擬開關(guān)，多路復(fù)用器，多路分解器 系列:- 其它有關(guān)文件:STG4159 View All Specifications 標準包裝:5,000 系列:- 功能:開關(guān) 電路:1 x SPDT 導(dǎo)通狀態(tài)電阻:300 毫歐 電壓電源:雙電源 電壓 - 電源，單路/雙路(±):±1.65 V ~ 4.8 V 電流 - 電源:50nA 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:7-WFBGA，F(xiàn)CBGA 供應(yīng)商設(shè)備封裝:7-覆晶 包裝:帶卷 (TR) |
| AD8188ARUZ-R7 | 功能描述:IC MULTIPLEXER TRPL 2X1 24TSSOP RoHS:是 類別:集成電路 (IC) >> 接口 - 模擬開關(guān)，多路復(fù)用器，多路分解器 系列:- 標準包裝:1,000 系列:- 功能:多路復(fù)用器 電路:1 x 4:1 導(dǎo)通狀態(tài)電阻:- 電壓電源:雙電源 電壓 - 電源，單路/雙路(±):±5V 電流 - 電源:7mA 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:16-SOIC 包裝:帶卷 (TR) |
| AD8188ARUZ-RL | 功能描述:IC MULTIPLEXER TRPL 2:1 24TSSOP RoHS:是 類別:集成電路 (IC) >> 接口 - 模擬開關(guān)，多路復(fù)用器，多路分解器 系列:- 標準包裝:1,000 系列:- 功能:多路復(fù)用器 電路:1 x 4:1 導(dǎo)通狀態(tài)電阻:- 電壓電源:雙電源 電壓 - 電源，單路/雙路(±):±5V 電流 - 電源:7mA 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:16-SOIC 包裝:帶卷 (TR) |
| AD8188Z-EVALZ | 制造商:AD 制造商全稱:Analog Devices 功能描述:350 MHz Single-Supply (5 V) Triple 2:1 Multiplexers |
| AD8189 | 制造商:AD 制造商全稱:Analog Devices 功能描述:350 MHz Single-Supply (5 V) Triple 2:1 Multiplexers |
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