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參數資料
| 型號： | ADF4112BRU |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | XO, clock |
| 英文描述： | Circular Connector; MIL SPEC:MIL-DTL-38999 Series I; Body Material:Metal; Series:LJT; No. of Contacts:37; Connector Shell Size:15; Connecting Termination:Crimp; Circular Shell Style:Straight Plug; Body Style:Straight RoHS Compliant: No |
| 中文描述： | PLL FREQUENCY SYNTHESIZER, 3000 MHz, PDSO16 |
| 封裝： | MO-153AB, TSSOP-16 |
| 文件頁數： | 4/24頁 |
| 文件大小： | 263K |
| 代理商： | ADF4112BRU |
REV. 0
ADF4110/ADF4111/ADF4112/ADF4113
–4–
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumu-
late on the human body and test equipment and can discharge without detection. Although the
ADF4110/ADF4111/ADF4112/ADF4113 features proprietary ESD protection circuitry, permanent
damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS
1, 2
(T
A
= 25
°
C unless otherwise noted)
AV
DD
to GND
3
. . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AV
DD
to DV
DD
. . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
V
P
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
V
P
to AV
DD
. . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +5.5 V
Digital I/O Voltage to GND . . . . . . . . –0.3 V to V
DD
+ 0.3 V
Analog I/O Voltage to GND . . . . . . . . . –0.3 V to V
P
+ 0.3 V
REF
IN
, RF
IN
A, RF
IN
B to GND . . . . . . –0.3 V to V
DD
+ 0.3 V
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . –40
°
C to +85
°
C
Storage Temperature Range . . . . . . . . . . . . –65
°
C to +150
°
C
Maximum Junction Temperature . . . . . . . . . . . . . . . . 150
°
C
TSSOP
θ
JA
Thermal Impedance . . . . . . . . . . . . . 150.4
°
C/W
CSP
θ
JA
Thermal Impedance (Paddle Soldered) . . . 122
°
C/W
CSP
θ
JA
Thermal Impedance
(Paddle Not Soldered) . . . . . . . . . . . . . . . . . . . . . 216
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°
C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
This device is a high-performance RF integrated circuit with an ESD rating of
< 2 kV and it is ESD sensitive. Proper precautions should be taken for handling
and assembly.
3
GND = AGND = DGND = 0 V.
TRANSISTOR COUNT
6425 (CMOS) and 303 (Bipolar).
ORDERING GUIDE
Model
Temperature Range
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
Package Description
Package Option
*
ADF4110BRU
ADF4110BCP
ADF4111BRU
ADF4111BCP
ADF4112BRU
ADF4112BCP
ADF4113BRU
ADF4113BCP
ADF4113BCHIPS
Thin Shrink Small Outline Package (TSSOP)
Chip Scale Package (CSP)
Thin Shrink Small Outline Package (TSSOP)
Chip Scale Package (CSP)
Thin Shrink Small Outline Package (TSSOP)
Chip Scale Package (CSP)
Thin Shrink Small Outline Package (TSSOP)
Chip Scale Package (CSP)
DICE
RU-16
CP-20
RU-16
CP-20
RU-16
CP-20
RU-16
CP-20
DICE
*
Contact the factory for chip availability.
CLOCK
DATA
LE
LE
DB20 (MSB)
DB19
DB2
DB1
(CONTROL BIT C2)
DB0 (LSB)
(CONTROL BIT C1)
t
6
t
5
t
1
t
2
t
3
t
4
Figure 1. Timing Diagram
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相關代理商/技術參數 |
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| ADF4112BRU-REEL | 制造商:Analog Devices 功能描述:PLL Frequency Synthesizer Single 16-Pin TSSOP T/R |
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