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參數(shù)資料
型號: ADF4153BCP-REEL
廠商: ANALOG DEVICES INC
元件分類: XO, clock
英文描述: Fractional-N Frequency Synthesizer
中文描述: PLL FREQUENCY SYNTHESIZER, 4000 MHz, QCC20
封裝: 4 X 4 MM, MO-220VGGD-1, LFCSP-20
文件頁數(shù): 21/24頁
文件大小: 354K
代理商: ADF4153BCP-REEL
ADF4153
ADSP-2181 Interface
Figure 22 shows the interface between the ADF4153 and the
ADSP-21xx digital signal processor. As discussed previously, the
ADF4153 needs a 24-bit serial word for each latch write. The
easiest way to accomplish this using the ADSP-21xx family is to
use the autobuffered transmit mode of operation with alternate
framing. This provides a means for transmitting an entire block
of serial data before an interrupt is generated. Set up the word
length for eight bits and use three memory locations for each
24-bit word. To program each 24-bit latch, store the three 8-bit
bytes, enable the autobuffered mode, and write to the transmit
register of the DSP. This last operation initiates the autobuffer
transfer.
Rev. A | Page 21 of 24
ADSP-21xx
ADF4153
SCLOCK
SCLK
SDATA
LE
MUXOUT
(LOCK DETECT)
DT
TFS
I/O FLAGS
0
Figure 22. ADSP-21xx to ADF4153 Interface
PCB DESIGN GUIDELINES FOR CHIP SCALE
PACKAGE
The lands on the chip scale package (CP-20) are rectangular.
The printed circuit board pad for these should be 0.1 mm
longer than the package land length and 0.05 mm wider than
the package land width. The land should be centered on the pad.
This ensures that the solder joint size is maximized.
The bottom of the chip scale package has a central thermal pad.
The thermal pad on the printed circuit board should be at least
as large as this exposed pad. On the printed circuit board, there
should be a clearance of at least 0.25 mm between the thermal
pad and the inner edges of the pad pattern. This ensures that
shorting is avoided.
Thermal vias may be used on the printed circuit board thermal
pad to improve thermal performance of the package. If vias are
used, they should be incorporated in the thermal pad at 1.2 mm
pitch grid. The via diameter should be between 0.3 mm and
0.33 mm, and the via barrel should be plated with 1 oz. copper
to plug the via.
The user should connect the printed circuit board thermal pad
to AGND.
相關(guān)PDF資料
PDF描述
ADF4153BCP-REEL7 Fractional-N Frequency Synthesizer
ADF4153BRU Fractional-N Frequency Synthesizer
ADF4153BRU-REEL Fractional-N Frequency Synthesizer
ADF4153BRU-REEL7 Fractional-N Frequency Synthesizer
ADF4154 Fractional-N Frequency Synthesizer
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
ADF4153BCP-REEL7 制造商:Analog Devices 功能描述:PLL Frequency Synthesizer Single 20-Pin LFCSP EP T/R
ADF4153BCPZ 功能描述:IC PLL FREQ SYNTHESIZER 20-LFCSP RoHS:是 類別:集成電路 (IC) >> 時鐘/計時 - 時鐘發(fā)生器,PLL,頻率合成器 系列:- 標(biāo)準(zhǔn)包裝:2,000 系列:- 類型:PLL 頻率合成器 PLL:是 輸入:晶體 輸出:時鐘 電路數(shù):1 比率 - 輸入:輸出:1:1 差分 - 輸入:輸出:無/無 頻率 - 最大:1GHz 除法器/乘法器:是/無 電源電壓:4.5 V ~ 5.5 V 工作溫度:-20°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-LSSOP(0.175",4.40mm 寬) 供應(yīng)商設(shè)備封裝:16-SSOP 包裝:帶卷 (TR) 其它名稱:NJW1504V-TE1-NDNJW1504V-TE1TR
ADF4153BCPZ-RL 功能描述:IC FRACTION-N FREQ SYNTH 20LFCSP RoHS:是 類別:集成電路 (IC) >> 時鐘/計時 - 時鐘發(fā)生器,PLL,頻率合成器 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:Precision Edge® 類型:時鐘/頻率合成器 PLL:無 輸入:CML,PECL 輸出:CML 電路數(shù):1 比率 - 輸入:輸出:2:1 差分 - 輸入:輸出:是/是 頻率 - 最大:10.7GHz 除法器/乘法器:無/無 電源電壓:2.375 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-VFQFN 裸露焊盤,16-MLF? 供應(yīng)商設(shè)備封裝:16-MLF?(3x3) 包裝:帶卷 (TR) 其它名稱:SY58052UMGTRSY58052UMGTR-ND
ADF4153BCPZ-RL7 功能描述:IC FRACTION-N FREQ SYNTH 20LFCSP RoHS:是 類別:集成電路 (IC) >> 時鐘/計時 - 時鐘發(fā)生器,PLL,頻率合成器 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:Precision Edge® 類型:時鐘/頻率合成器 PLL:無 輸入:CML,PECL 輸出:CML 電路數(shù):1 比率 - 輸入:輸出:2:1 差分 - 輸入:輸出:是/是 頻率 - 最大:10.7GHz 除法器/乘法器:無/無 電源電壓:2.375 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-VFQFN 裸露焊盤,16-MLF? 供應(yīng)商設(shè)備封裝:16-MLF?(3x3) 包裝:帶卷 (TR) 其它名稱:SY58052UMGTRSY58052UMGTR-ND
ADF4153BRU 功能描述:IC SYNTH PLL RF F-N FREQ 16TSSOP RoHS:否 類別:集成電路 (IC) >> 時鐘/計時 - 時鐘發(fā)生器,PLL,頻率合成器 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:Precision Edge® 類型:時鐘/頻率合成器 PLL:無 輸入:CML,PECL 輸出:CML 電路數(shù):1 比率 - 輸入:輸出:2:1 差分 - 輸入:輸出:是/是 頻率 - 最大:10.7GHz 除法器/乘法器:無/無 電源電壓:2.375 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-VFQFN 裸露焊盤,16-MLF? 供應(yīng)商設(shè)備封裝:16-MLF?(3x3) 包裝:帶卷 (TR) 其它名稱:SY58052UMGTRSY58052UMGTR-ND
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