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參數(shù)資料
型號: ADF4210BRU
廠商: ANALOG DEVICES INC
元件分類: XO, clock
英文描述: Dual RF/IF PLL Frequency Synthesizers
中文描述: PLL FREQUENCY SYNTHESIZER, 1200 MHz, PDSO20
封裝: TSSOP-20
文件頁數(shù): 19/20頁
文件大小: 251K
代理商: ADF4210BRU
REV. A
ADF4210/ADF4211/ADF4212/ADF4213
–19–
PCB Guidelines for Chip Scale Package
The lands on the chip scale package (CP-20), are rectangular.
The printed circuit board pad for these should be 0.1 mm
longer than the package land length and 0.05 mm wider than
the package land width. The land should be centered on the
pad. This will ensure that the solder joint size is maximized.
The bottom of the chip scale package has a central thermal pad.
The thermal pad on the printed circuit board should be at least
as large as this exposed pad. On the printed circuit board, there
should be clearance of at least 0.25 mm between the thermal
pad and inner edges of the pad pattern. This will ensure that
shorting is avoided.
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
Thin Shrink Small Outline Package (TSSOP)
(RU-20)
20
11
10
1
0.256 (6.50)
0.246 (6.25)
0.177 (4.50)
0.169 (4.30)
PIN 1
0.006 (0.15)
0.002 (0.05)
0.260 (6.60)
0.252 (6.40)
SEATING
PLANE
0.0118 (0.30)
0.0075 (0.19)
0.0256 (0.65)
BSC
0.0433 (1.10)
MAX
0.0079 (0.20)
0.0035 (0.090)
0.028 (0.70)
0.020 (0.50)
8
0
Chip Scale Package
(CP-20)
1
20
5
6
11
16
15
BVIEW
10
0.080 (2.25)
0.083 (2.10) SQ
0.077 (1.95)
0.024 (0.60)
0.017 (0.42)
0.009 (0.24)
0.024 (0.60)
0.017 (0.42)
0.009 (0.24)
0.012 (0.30)
0.009 (0.23)
0.007 (0.18)
0.030 (0.75)
0.022 (0.60)
0.014 (0.50)
0.080 (2.00)
REF
0.010 (0.25)
MIN
0.020 (0.50)
BSC
12
MAX
0.008 (0.20)
REF
0.031 (0.80) MAX
0.026 (0.65) NOM
0.002 (0.05)
0.0004 (0.01)
0.0 (0.0)
0.035 (0.90) MAX
0.033 (0.85) NOM
SEATING
PLANE
CONTROLLING DIMENSIONS ARE IN MILLIMETERS
PIN 1
INDICATOR
TOP
0.148 (3.75)
BSC SQ
0.157 (4.0)
BSC SQ
Thermal vias may be used on the printed circuit board thermal
pad to improve thermal performance of the package. If vias are
used, they should be incorporated in the thermal pad at 1.2 mm
grid pitch. The via diameter should be between 0.3 mm and
0.33 mm and the via barrel should be plated with 1 oz. copper
to plug the via. The user should connect the printed circuit
board pad to AGND.
相關PDF資料
PDF描述
ADF4211 Dual RF/IF PLL Frequency Synthesizers
ADF4211BCP Dual RF/IF PLL Frequency Synthesizers
ADF4211BRU Dual RF/IF PLL Frequency Synthesizers
ADF4212BCP Dual RF/IF PLL Frequency Synthesizers
ADF4212BRU Dual RF/IF PLL Frequency Synthesizers
相關代理商/技術參數(shù)
參數(shù)描述
ADF4211 制造商:AD 制造商全稱:Analog Devices 功能描述:Dual RF/IF PLL Frequency Synthesizers
ADF4211BCP 制造商:Rochester Electronics LLC 功能描述:- Bulk
ADF4211BRU 制造商:AD 制造商全稱:Analog Devices 功能描述:Dual RF/IF PLL Frequency Synthesizers
ADF4212 制造商:AD 制造商全稱:Analog Devices 功能描述:Dual RF/IF PLL Frequency Synthesizers
ADF4212BCP 制造商:Analog Devices 功能描述:PLL FREQ SYNTHESIZER DUAL UP TO 200MHZ 20LFCSP EP - Bulk
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