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參數(shù)資料
型號(hào): ADF7011BRU-REEL7
廠商: ANALOG DEVICES INC
元件分類(lèi): 通信及網(wǎng)絡(luò)
英文描述: High Performance ISM Band ASK/FSK/GFSK Transmitter IC
中文描述: SPECIALTY TELECOM CIRCUIT, PDSO24
封裝: MO-153AD, TSSOP-24
文件頁(yè)數(shù): 4/24頁(yè)
文件大小: 567K
代理商: ADF7011BRU-REEL7
REV. 0
–4–
ADF7011
TIMING CHARACTERISTICS
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although the
ADF7011 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are recommended
to avoid performance degradation or loss of functionality.
ABSOLUTE MAXIMUM RATINGS
1, 2
(T
A
= 25
°
C, unless otherwise noted.)
V
DD
to GND
3
. . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to + 7 V
CPV
DD
to GND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to + 7 V
Digital I/O Voltage to GND . . . . . . . –0.3 V to DV
DD
+ 0.3 V
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . –40
°
C to +85
°
C
Storage Temperature Range . . . . . . . . . . . . –65
°
C to +125
°
C
Maximum Junction Temperature . . . . . . . . . . . . . . . . . 125
°
C
TSSOP
JA
Thermal Impedance . . . . . . . . . . . . . . 150.4
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 235
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 240
°
C
ORDERING GUIDE
Temperature
Range
Model
Package Option
ADF7011BRU
ADF7011BRU-REEL
ADF7011BRU-REEL7
–40oC to +85oC
–40oC to +85oC
–40oC to +85oC
RU-24 (TSSOP)
RU-24 (TSSOP)
RU-24 (TSSOP)
(V
DD
= 3 V 10%; VGND = 0 V, T
A
= 25 C, unless otherwise noted.)
Limit at
T
MIN
to T
MAX
(B Version)
Parameter
Unit
Test Conditions/Comments
t
1
t
2
t
3
t
4
t
5
t
6
10
10
25
25
10
20
ns min
ns min
ns min
ns min
ns min
ns min
DATA to CLOCK Setup Time
DATA to CLOCK Hold Time
CLOCK High Duration
CLOCK Low Duration
CLOCK to LE Setup Time
LE Pulsewidth
Guaranteed by design but not production tested.
Specifications subject to change without notice.
CLOCK
DB23 (MSB)
DB22
DB2
DB1
(CONTROL BIT C2)
DATA
LE
DB0 (LSB)
(CONTROL BIT C1)
t
6
t
1
t
2
t
3
t
4
t
5
Figure 1. Timing Diagram
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
This device is a high performance RF integrated circuit with an ESD rating of
<1 kV and is ESD sensitive. Proper precautions should be taken for handling and
assembly.
3
GND = VCOGND = CPGND = RFGND = DGND = AGND = 0 V.
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