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參數資料
| 型號： | ADG508FBN |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | 運動控制電子 |
| 英文描述： | 4/8 Channel Fault-Protected Analog Multiplexers |
| 中文描述： | 8-CHANNEL, SGL ENDED MULTIPLEXER, PDIP16 |
| 封裝： | PLASTIC, MS-001AB, DIP-16 |
| 文件頁數： | 4/12頁 |
| 文件大小： | 170K |
| 代理商： | ADG508FBN |
REV. C
–4–
ADG508F/ADG509F/ADG528F
ABSOLUTE MAXIMUM RATINGS*
(T
A
= +25
°
C unless otherwise noted)
V
DD
to V
SS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+44 V
V
DD
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +25 V
V
SS
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –25 V
V
EN
, V
A
Digital Input . . . . . . .– 0.3 V to V
DD
+ 2 V or 20 mA,
Whichever Occurs First
V
S
, Analog Input Overvoltage with Power ON . . . . . V
SS
– 25 V
to V
DD
+ 40 V
V
S
, Analog Input Overvoltage with Power OFF
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–40 V to +55 V
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 20 mA
Peak Current, S or D
(Pulsed at 1 ms, 10% Duty Cycle max) . . . . . . . . . . . 40 mA
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . . –40
°
C to +85
°
C
Extended (T Version) . . . . . . . . . . . . . . . . –55
°
C to +125
°
C
Storage Temperature Range . . . . . . . . . . . . . –65
°
C to +150
°
C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150
°
C
Cerdip Package
θ
JA
, Thermal Impedance
16-Lead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
°
C/W
18-Lead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
°
C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +300
°
C
Plastic Package
θ
JA
, Thermal Impedance
16-Lead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
°
C
18-Lead . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 110
°
C
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260
°
C
SOIC Package
θ
JA
, Thermal Impedance
Narrow Body . . . . . . . . . . . . . . . . . . . . . . . . . . . . 77
°
C/W
Wide Body . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°
C
PLCC Package
θ
JA
, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 90
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220
°
C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
ADG508F/ADG509F PIN CONFIGURATIONS
DIP/SOIC DIP/SOIC
A0
EN
A1
A2
S2
S3
S4
S5
S6
S7
S1
GND
V
DD
D
S8
1
2
16
15
5
6
7
12
11
10
3
4
14
13
8
9
TOP VIEW
(Not to Scale)
ADG508F
V
SS
A0
EN
A1
GND
S2A
S3A
S4A
S2B
S3B
S4B
V
SS
S1A
V
DD
S1B
DA
DB
1
2
16
15
5
6
7
12
11
10
3
4
14
13
8
9
TOP VIEW
(Not to Scale)
ADG509F
ADG528F PIN CONFIGURATIONS
DIP PLCC
WR
A0
RS
A1
S1
S2
S3
S5
S6
EN
V
SS
A2
S4
S7
D
S8
V
DD
GND
1
2
18
17
5
6
7
14
13
12
3
4
16
15
8
11
9
10
TOP VIEW
(Not to Scale)
ADG528F
EN
V
SS
S1
S3
S2
A
W
A
N
R
19
3
1
2
20
4
5
8
6
7
12 13
9
11
10
18
17
14
16
15
TOP VIEW
(Not to Scale)
ADG528F
A2
GND
S6
V
DD
S5
S
D
S
S
N
NC = NO CONNECT
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although these devices feature proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
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相關代理商/技術參數 |
參數描述 |
|---|---|
| ADG508FBNZ | 功能描述:IC MULTIPLEXER 8X1 16DIP RoHS:是 類別:集成電路 (IC) >> 接口 - 模擬開關，多路復用器，多路分解器 系列:- 特色產品:MicroPak? 標準包裝:1 系列:- 功能:開關 電路:2 x SPST - NC 導通狀態電阻:500 毫歐 電壓電源:單電源 電壓 - 電源，單路/雙路(±):1.4 V ~ 4.3 V 電流 - 電源:150nA 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:8-XFDFN 供應商設備封裝:8-XSON，SOT833-1 （1.95x1） 包裝:Digi-Reel® 其它名稱:568-5557-6 |
| ADG508FBP | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:8-Channel Analog Multiplexer |
| ADG508FBR | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Interface IC |
| ADG508FBRN | 功能描述:IC MULTIPLEXER 8X1 16SOIC RoHS:否 類別:集成電路 (IC) >> 接口 - 模擬開關，多路復用器，多路分解器 系列:- 其它有關文件:STG4159 View All Specifications 標準包裝:5,000 系列:- 功能:開關 電路:1 x SPDT 導通狀態電阻:300 毫歐 電壓電源:雙電源 電壓 - 電源，單路/雙路(±):±1.65 V ~ 4.8 V 電流 - 電源:50nA 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:7-WFBGA，FCBGA 供應商設備封裝:7-覆晶 包裝:帶卷 (TR) |
| ADG508FBRN-REEL7 | 制造商:Analog Devices 功能描述:Analog Multiplexer Single 8:1 16-Pin SOIC N T/R |
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