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參數資料
| 型號： | ADG658YCP |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | 運動控制電子 |
| 英文描述： | +3 V/+5 V/【5 V CMOS 4-/8-Channel Analog Multiplexers |
| 中文描述： | 8-CHANNEL, SGL ENDED MULTIPLEXER, QCC16 |
| 封裝： | 4 X 4 MM, MO-220VGGC, LFCSP-16 |
| 文件頁數： | 5/12頁 |
| 文件大小： | 549K |
| 代理商： | ADG658YCP |
ADG658/ADG659
–5–
ABSOLUTE MAXIMUM RATINGS
1
(T
A
= 25°C, unless otherwise noted.)
V
DD
to V
SS
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 V
V
DD
to GND . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +13 V
V
SS
to GND . . . . . . . . . . . . . . . . . . . . . . . .+0.3 V to –6.5 V
Analog Inputs
2
. . . . . . . . . . . . . . V
SS
– 0.3 V to V
DD
+ 0.3 V
Digital Inputs
2
. . . . . . . . . . . . GND – 0.3 V to V
DD
+ 0.3 V
or 10 mA, whichever occurs first
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . 40 mA
(Pulsed at 1 ms, 10% duty cycle max)
Continuous Current, S or D . . . . . . . . . . . . . . . . . 20 mA
Operating Temperature Range
Automotive (Y Version) . . . . . . . . . . . . –40°C to +125°C
Industrial (B Version) . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150°C
PIN CONFIGURATIONS
TSSOP
ADG659
TOP VIEW
(Not to Scale)
ADG658
TOP VIEW
(Not to Scale)
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
16
15
14
13
12
11
10
9
V
DD
S3
S2
S1
S4
A0
A1
A2
V
DD
S3A
S2A
DA
S1A
S4A
A0
A1
S1B
S3B
DB
S4B
S2B
EN
V
SS
GND
S5
S7
D
S8
S6
EN
V
SS
GND
LFCSP
12
11
10
9
1
2
3
4
16 15 14 13
5
6
7
8
D
S8
S6
EN
V
S
G
A
A
S2
S1
S4
A0
S
S
V
D
S
ADG659
TOP VIEW
(Not to Scale)
12
11
10
9
1
2
3
4
16 15 14 13
5
6
7
8
DB
S4B
S2B
EN
V
S
G
A
A
S2A
DA
S1A
S4A
S
S
V
D
S
ADG658
TOP VIEW
(Not to Scale)
ORDERING GUIDE
Package Description
Thin Shrink Small Outline Package (TSSOP)
Lead Frame Chip Scale Package (LFCSP)
Thin Shrink Small Outline Package (TSSOP)
Lead Frame Chip Scale Package (LFCSP)
Model
ADG658YRU
ADG658YCP
ADG659YRU
ADG659YCP
Temperature Range
–40°C to +125°C
–40°C to +85°C
–40°C to +125°C
–40°C to +85°C
Package Option
RU-16
CP-16
RU-16
CP-16
JA
Thermal Impedance, 16-Lead TSSOP . . . . . 150.4°C/W
JA
Thermal Impedance (4-Layer Board),
16-Lead LFCSP . . . . . . . . . . . . . . . . . . . . . . . .70°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 kV
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of
the device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability. Only one
absolute maximum rating may be applied at any one time.
2
Overvoltages at A
,
EN
, S, or D will be clamped by internal diodes. Current
should be limited to the maximum ratings given.
Table I. ADG658 Truth Table
A0
EN
X
1
0
0
1
0
0
0
1
0
0
0
1
0
0
0
1
0
A2
X
0
0
0
0
1
1
1
1
A1
X
0
0
1
1
0
0
1
1
Switch Condition
NONE
1
2
3
4
5
6
7
8
X = Don’t Care
Table II. ADG659 Truth Table
A0
EN
X
1
0
0
1
0
0
0
1
0
A1
X
0
0
1
1
On Switch Pair
NONE
1
2
3
4
X = Don’t Care
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily ac cu mu ate
on the human body and test equipment and can discharge without detection. Although the ADG658/
ADG659 feature proprietary ESD pro ec ion circuitry, permanent damage may occur on devices subjected
to high energy electrostatic discharges. Therefore, proper ESD pre cau ions are rec om mend ed to avoid
per or mance deg a da ion or loss of functionality.
REV. 0
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