- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄373991 > ADG784 (Analog Devices, Inc.) CMOS 3 V/5 V, Wide Bandwidth Quad 2:1 Mux in Chip Scale Package PDF資料下載
參數(shù)資料
| 型號(hào)： | ADG784 |
| 廠商： | Analog Devices, Inc. |
| 英文描述： | CMOS 3 V/5 V, Wide Bandwidth Quad 2:1 Mux in Chip Scale Package |
| 中文描述： | 3伏的CMOS / 5伏，寬帶四2:1復(fù)用在芯片級(jí)封裝 |
| 文件頁(yè)數(shù)： | 4/8頁(yè) |
| 文件大小： | 131K |
| 代理商： | ADG784 |
REV. 0
ADG784
–4–
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADG784 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ABSOLUTE MAXIMUM RATINGS
1
(T
A
= 25
°
C unless otherwise noted.)
V
DD
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6 V
Analog, Digital Inputs
2
. . . . . . . . . . –0.3 V to V
DD
+ 0.3 V or
30 mA, Whichever Occurs First
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . 100 mA
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 300 mA
(Pulsed at 1 ms, 10% Duty Cycle max)
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . –40
°
C to +85
°
C
Storage Temperature Range . . . . . . . . . . . . –65
°
C to +150
°
C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150
°
C
Chip Scale Package
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 32
°
C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215
°
C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220
°
C
ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2
Overvoltages at IN, S or D will be clamped by internal diodes. Current should be
limited to the maximum ratings given.
PIN CONFIGURATION
NC = NO CONNECT
NOTE: EXPOSED PAD TIED TO SUBSTRATE, GND.
15 S4A
14 S4B
13 D4
12 S3A
11 S3B
S1A 1
S1B 2
D1 3
S2A 4
S2B 5
2
D
N
G
N
D
1
1
1
1
E
PIN 1
ADG784
TOP VIEW
TERMINOLOGY
V
DD
GND
S
D
IN
EN
R
ON
R
ON
Most Positive Power Supply Potential.
Ground (0 V) Reference.
Source Terminal. May be an input or output.
Drain Terminal. May be an input or output.
Logic Control Input.
Logic Control Input.
Ohmic resistance between D and S.
On Resistance match between any two channels
i.e., R
ON
max – R
ON
min.
Flatness is defined as the difference between
the maximum and minimum value of on resis-
tance as measured over the specified analog
signal range.
Source Leakage Current with the switch “OFF.”
Drain Leakage Current with the switch “OFF.”
Channel Leakage Current with the switch “ON.”
Analog Voltage on Terminals D, S.
“OFF” Switch Source Capacitance.
“OFF” Switch Drain Capacitance.
C
D
, C
S
(ON) “ON” Switch Capacitance.
t
ON
Delay between applying the digital control input
and the output switching on. See Test Circuit 4.
t
OFF
Delay between applying the digital control input
and the output switching Off.
t
D
“OFF” time or “ON” time measured between
the 90% points of both switches, when switching
from one address state to another. See Test
Circuit 5.
Crosstalk
A measure of unwanted signal that is coupled
through from one channel to another as a result
of parasitic capacitance.
Off Isolation A measure of unwanted signal coupling through an
“OFF” switch.
Bandwidth
Frequency response of the switch in the ON
state measured at 3 dB down.
Distortion
R
FLAT(ON)
/R
L
R
FLAT(ON)
I
S
(OFF)
I
D
(OFF)
I
D
, I
S
(ON)
V
D
(V
S
)
C
S
(OFF)
C
D
(OFF)
ORDERING GUIDE
Model
Temperature Range
Package Description
Package Option
ADG784BCP
–40
°
C to +85
°
C
Chip Scale Package
CP-20
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ADG784BCP | CMOS 3 V/5 V, Wide Bandwidth Quad 2:1 Mux in Chip Scale Package |
| ADG786BCP | 2.5ohm, 1.8V to 5.5V, +-2.5 V Triple/Quad SPDT Switches in Chip Scale Packages |
| ADG788BCP | 2.5ohm, 1.8V to 5.5V, +-2.5 V Triple/Quad SPDT Switches in Chip Scale Packages |
| ADG786 | 2.5ohm, 1.8V to 5.5V, +-2.5 V Triple/Quad SPDT Switches in Chip Scale Packages |
| ADG788 | 2.5ohm, 1.8V to 5.5V, +-2.5 V Triple/Quad SPDT Switches in Chip Scale Packages |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ADG784BCP | 制造商:Analog Devices 功能描述:Analog Multiplexer Quad 2:1 20-Pin LFCSP EP 制造商:Rochester Electronics LLC 功能描述:QUAD SPDT I.C. - Bulk 制造商:Analog Devices 功能描述:Multiplexer IC Number of Channels:4 |
| ADG784BCP-REEL | 制造商:Analog Devices 功能描述:Analog Multiplexer Quad 2:1 20-Pin LFCSP EP T/R 制造商:Rochester Electronics LLC 功能描述:QUAD SPDT I.C. - Tape and Reel |
| ADG784BCP-REEL7 | 制造商:Analog Devices 功能描述:Analog Multiplexer Quad 2:1 20-Pin LFCSP EP T/R 制造商:Rochester Electronics LLC 功能描述:QUAD SPDT I.C. - Tape and Reel |
| ADG784BCPZ | 功能描述:IC MUX/DEMUX QUAD 2X1 20LFCSP RoHS:是 類別:集成電路 (IC) >> 接口 - 模擬開關(guān)，多路復(fù)用器，多路分解器 系列:- 特色產(chǎn)品:MicroPak? 標(biāo)準(zhǔn)包裝:1 系列:- 功能:開關(guān) 電路:2 x SPST - NC 導(dǎo)通狀態(tài)電阻:500 毫歐 電壓電源:單電源 電壓 - 電源，單路/雙路(±):1.4 V ~ 4.3 V 電流 - 電源:150nA 工作溫度:-40°C ~ 125°C 安裝類型:表面貼裝 封裝/外殼:8-XFDFN 供應(yīng)商設(shè)備封裝:8-XSON，SOT833-1 （1.95x1） 包裝:Digi-Reel® 其它名稱:568-5557-6 |
| ADG784BCPZ-REEL | 功能描述:IC MUX/DEMUX QUAD 2X1 20LFCSP RoHS:是 類別:集成電路 (IC) >> 接口 - 模擬開關(guān)，多路復(fù)用器，多路分解器 系列:- 標(biāo)準(zhǔn)包裝:1,000 系列:- 功能:多路復(fù)用器 電路:1 x 4:1 導(dǎo)通狀態(tài)電阻:- 電壓電源:雙電源 電壓 - 電源，單路/雙路(±):±5V 電流 - 電源:7mA 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:16-SOIC（0.154"，3.90mm 寬） 供應(yīng)商設(shè)備封裝:16-SOIC 包裝:帶卷 (TR) |
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。