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參數資料
| 型號： | ADG919BRM |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | 衰減器 |
| 英文描述： | Wideband, 43dB Isolation 1GHz, CMOS 1.65 V to 2.75V, 2:1 Mux/SPDT Switches |
| 中文描述： | 0 MHz - 4000 MHz RF/MICROWAVE DIVERSITY SWITCH, 1.25 dB INSERTION LOSS |
| 封裝： | RM-8, MO-187AA, MSOP-8 |
| 文件頁數： | 3/4頁 |
| 文件大?。?/td> | 120K |
| 代理商： | ADG919BRM |
ADG918/ADG919
–3–
REV. PrC
PRELIMINARY TECHNICAL DATA
ABSOLUTE MAXIMUM RATINGS
1
(T
A
= +25°C unless otherwise noted)
V
DD
to GND
Inputs
to GND
Input Power
Operating Temperature Range
Industrial (B Version)
Storage Temperature Range
Junction Temperature
MSOP Package
θ
JA
Thermal Impedance
CSP Package
θ
JA
Thermal Impedance
Lead Temperature, Soldering (10seconds)
IR Reflow, Peak Temperature (<20 seconds)
-0.5 V to +4 V
-0.5 V to V
DD
+ 0.3V
TBD dBm
–40°C to +85°C
–65°C to +150°C
+150°C
206°C/W
TBD°C/W
300°C
+235°C
NOTES
1
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent
damage to the device. This is a stress rating only and functional operation of the device
at these or any other conditions above those listed in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability. Only one absolute maximum rating may
be applied at any one time.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG919 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
ORDERING GUIDE
Model
Temperature Range
Package Descriptions
Branding
Package Options
ADG918BRM
ADG918BCP
ADG919BRM
ADG919BCP
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
MSOP (Micro Small Outline Package)
Chip Scale Package
MSOP (Micro Small Outline Package)
Chip Scale Package
RM-8
CP-8
RM-8
CP-8
PIN CONFIGURATION
8-Lead MSOP (RM-8)
3x3mm CSP (CP-8)
TOP VIEW
(Not to Scale)
8
7
6
5
1
2
3
4
VDD
CONTROL
GND
RFCommon
ADG918/
ADG919
GND
GND
RF1
RF2
相關PDF資料 |
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|---|---|
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| ADG936BRU-R-500RL7 | Wideband 4 GHz, 36 dB Isolation at 1 GHz, CMOS 1.65 V to 2.75 V, Dual SPDT |
| ADG936BRU-R-REEL | Wideband 4 GHz, 36 dB Isolation at 1 GHz, CMOS 1.65 V to 2.75 V, Dual SPDT |
| ADG936 | Wideband 4 GHz, 36 dB Isolation at 1 GHz, CMOS 1.65 V to 2.75 V, Dual SPDT |
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相關代理商/技術參數 |
參數描述 |
|---|---|
| ADG919BRM-500RL7 | 制造商:AD 制造商全稱:Analog Devices 功能描述:Wideband 4 GHz, 43 dB Isolation at 1 GHz, CMOS 1.65 V to 2.75 V, 2:1 Mux/SPDT |
| ADG919BRM-REEL | 功能描述:IC SWITCH SPDT 2:1 MUX 8MSOP RoHS:否 類別:RF/IF 和 RFID >> RF 開關 系列:- 標準包裝:25,000 系列:* RF 型:通用 頻率:0Hz ~ 3GHz 特點:SPDT 封裝/外殼:6-XFDFN 裸露焊盤 供應商設備封裝:TSLP-7 包裝:帶卷 (TR) 其它名稱:SP000671392 |
| ADG919BRM-REEL7 | 功能描述:IC SW ONE HS SPDT 1.6/2.7V 8MSOP RoHS:否 類別:RF/IF 和 RFID >> RF 開關 系列:- 標準包裝:25,000 系列:* RF 型:通用 頻率:0Hz ~ 3GHz 特點:SPDT 封裝/外殼:6-XFDFN 裸露焊盤 供應商設備封裝:TSLP-7 包裝:帶卷 (TR) 其它名稱:SP000671392 |
| ADG919BRMZ | 功能描述:IC SW SPDT 2:1 REFL MUX 8-MSOP RoHS:是 類別:RF/IF 和 RFID >> RF 開關 系列:- 標準包裝:25,000 系列:* RF 型:通用 頻率:0Hz ~ 3GHz 特點:SPDT 封裝/外殼:6-XFDFN 裸露焊盤 供應商設備封裝:TSLP-7 包裝:帶卷 (TR) 其它名稱:SP000671392 |
| ADG919BRMZ1 | 制造商:AD 制造商全稱:Analog Devices 功能描述:Wideband 4 GHz, 43 dB Isolation at 1 GHz, CMOS 1.65 V to 2.75 V, 2:1 Mux/SPDT |
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