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參數資料
| 型號： | ADL5542ACPZ-R7 |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | 衰減器 |
| 英文描述： | 50 MHz to 6 GHz RF/IF Gain Block |
| 中文描述： | 50 MHz - 6000 MHz RF/MICROWAVE WIDE BAND MEDIUM POWER AMPLIFIER |
| 封裝： | 3X3 MM, ROHS COMPLIANT, LFCSP-8 |
| 文件頁數： | 10/12頁 |
| 文件大小： | 193K |
| 代理商： | ADL5542ACPZ-R7 |
ADL5542
BASIC CONNECTIONS
The basic connections for operating the ADL5542 are shown in
Figure 13. Recommended components are listed in Table 5. The
input and output should be ac-coupled with appropriately sized
capacitors (device characterization was performed with 33 pF
capacitors). A 5 V dc bias is supplied to the amplifier via VPOS
(Pin 5) and through a biasing inductor connected to RFOUT
(Pin 8). The bias voltage should be decoupled using a 1 μF
capacitor, a 1.2 nF capacitor, and two 68 pF capacitors.
Rev. A | Page 10 of 12
4.0
1.5
50
500
FREQUENCY (MHz)
N
3.5
3.0
2.5
2.0
VCC
3 GND
6
GND
4 CB
5
VPOS
1 RFIN
8
RFOUT
2 GND
7
GND
ADL5542
C4
68pF
C5
1.2nF
C6
1μF
VCC
C2
33pF
C1
33pF
RFIN
RFOUT
L1
47nH
C3
1μF
100
150
200
250
300
350
400
450
0
GND
C7
68pF
0
50
500
FREQUENCY (MHz)
0
Figure 13. Basic Connections
For operation between 50 MHz and 500 MHz, a larger biasing
choke and ac coupling capacitors are necessary (see Table 5).
Figure 14 shows a plot of the input return loss, the output
return loss, and the gain with these components. At 100 MHz,
the ADL5542 achieves an OIP3 of 38 dBm (P
OUT
= 0 dBm per
tone). The noise figure performance for operation from 50 MHz
to 500 MHz is shown in Figure 15. When operating below
50 MHz, the ADL5542 exhibits gain peaking, and the input
and output match degrade significantly.
21.0
18.0
G
10
0
–10
–20
–30
–40
–50
R
100
150
200
250
300
350
400
450
0
20.5
20.0
19.5
19.0
18.5
S11
S21
S22
Figure 14. Input Return Loss (S11), Output Return Loss (S22), and
Gain (S21) vs. Frequency
Figure 15. Noise Figure vs. Frequency
SOLDERING INFORMATION AND RECOMMENDED
PCB LAND PATTERN
Figure 16 shows the recommended land pattern for the ADL5542.
To minimize thermal impedance, the exposed paddle on the
package underside should be soldered down to a ground plane
along with Pin 2, Pin 3, Pin 6, and Pin 7. If multiple ground
layers exist, they should be stitched together using vias (a
minimum of five vias is recommended). For more information
on land pattern design and layout, refer to Application Note
AN-772,
A Design and Manufacturing Guide for the Lead Frame
Chip Scale Package (LFCSP).
PIN 1
PIN 4
PIN 8
PIN 5
1.85mm
2.03mm
1.78mm
0.5mm
0.71mm
1.53mm
0
Figure 16. Recommended Land Pattern
Table 5. Recommended Components for Basic Connections
Frequency
C1
50 MHz to 500 MHz
0.1 μF
500 MHz to 6000 MHz
33 pF
C2
0.1 μF
33 pF
C3
1 μF
1 μF
L1
470 nH (Coilcraft 0603LS-471NXJL_ or equivalent)
47 nH (Coilcraft 0603CS-47NXJL_ or equivalent)
C4
68 pF
68 pF
C5
1.2 nF
1.2 nF
C6
1 μF
1 μF
C7
68 pF
68 pF
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