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參數資料
| 型號： | ADN2841ACP-48-RL |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | 其它接口 |
| 英文描述： | Dual-Loop 50 Mbps.2.7 Gbps Laser Diode Driver |
| 中文描述： | SPECIALTY INTERFACE CIRCUIT, QCC48 |
| 封裝： | MO-220-VKKD-2, LFCSP-48 |
| 文件頁數： | 3/12頁 |
| 文件大小： | 276K |
| 代理商： | ADN2841ACP-48-RL |
REV. 0
–3–
ADN2841
Parameter
Min
Typ
Max
Unit
Conditions/Comments
IBMON, IMMON, IMPDMON, IMPDMON2
IBMON, IMMON Division Ratio
IMPDMON, IMPDMON2
IMPDMON to IMPDMON2 Matching
Compliance Voltage
100
1
A/A
A/A
%
V
1
V
CC
– 1.2
IMPD = 1200
μ
A
0
SUPPLY
I
CC5
V
CC6
0.05
5.0
A
V
I
BIAS
= I
MOD
= 0
4.5
5.5
NOTES
1
Temperature Range: –40
°
C to +85
°
C
2
When the voltage on DATAP is greater than the voltage on DATAN, the modulation current flows in the IMODP pin.
3
Guaranteed by design and characterization. Not production tested.
4
IDTONE may cause eye distortion.
5
I
for power calculation is the typical I
CC
given.
6
All V
CCS
should be shorted together.
Specifications subject to change without notice.
ABSOLUTE MAXIMUM RATINGS
1
(T
A
= 25
°
C unless otherwise noted.)
V
CC
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
Operating Temperature Range
Industrial . . . . . . . . . . . . . . . . . . . . . . . . . . –40
°
C to +85
°
C
Storage Temperature Range . . . . . . . . . . –65
°
C to +150
°
C
Junction Temperature (T
J
MAX
) . . . . . . . . . . . . . . . . . . 150
°
C
48-Lead LFCSP Package
Power Dissipation . . . . . . . . . . . . . . .(T
J
MAX
– T
A
)/
θ
JA
mW
θ
JA
Thermal Impedance
2
. . . . . . . . . . . . . . . . . . . . 25
°
C/W
Lead Temperature (Soldering for 10 sec) . . . . . . . . 300
°
C
ORDERING GUIDE
Model
Temperature Range
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
–40
°
C to +85
°
C
Package Description
ADN2841ACP-32
ADN2841ACP-48
ADN2841ACP-32-RL
ADN2841ACP-32-RL7
ADN2841ACP-48-RL
32-Lead LFCSP
48-Lead LFCSP
32-Lead LFCSP
32-Lead LFCSP
48-Lead LFCSP
32-Lead LFCSP Package
Power Dissipation . . . . . . . . . . . . . . . (T
J MAX
– T
A
)/
θ
JA
mW
θ
JA
Thermal Impedance
2
. . . . . . . . . . . . . . . . . . . . 32
°
C/W
Lead Temperature (Soldering for 10 sec) . . . . . . . . . 300
°
C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Transient currents of
up to 100 mA will not cause SCR latch-up.
2
θ
JA
is defined when the part is soldered onto a four-layer board.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADN2841 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
SETUP
t
S
HOLD
t
H
DATAP/N
CLKP
Figure 1. Setup and Hold Time
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