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參數(shù)資料
| 型號： | ADSP-21XX |
| 廠商： | Analog Devices, Inc. |
| 英文描述： | ADSP-2100 Family DSP Microcomputers |
| 中文描述： | 的ADSP - 2100系列DSP的微機 |
| 文件頁數(shù)： | 16/32頁 |
| 文件大小： | 231K |
| 代理商： | ADSP-21XX |
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ADSP-21mod870
–16–
REV. 0
WARNING!
ESD SENSITIVE DEVICE
ESD SENSITIVITY
The ADSP-21mod870 is an ESD (electrostatic discharge) sensitive device. Electrostatic charges
readily accumulate on the human body and equipment and can discharge without detection.
Permanent damage may occur to devices subjected to high energy electrostatic discharges.
The ADSP-21mod870 features proprietary ESD protection circuitry to dissipate high energy
discharges (Human Body Model) per method 3015 of MIL-STD-883. Proper ESD precautions are
recommended to avoid performance degradation or loss of functionality. Unused devices must be
stored in conductive foam or shunts, and the foam should be discharged to the destination before
devices are removed.
ABSOLUTE MAXIMUM RATINGS*
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +4.6 V
Input Voltage . . . . . . . . . . . . . . . . . . . . –0.5 V to V
DD
+ 0.5 V
Output Voltage Swing . . . . . . . . . . . . . –0.5 V to V
DD
+ 0.5 V
Operating Temperature Range (Ambient) . . –40
°
C to +85
°
C
Storage Temperature Range . . . . . . . . . . . . –65
°
C to +150
°
C
Lead Temperature (5 sec) LQFP . . . . . . . . . . . . . . . . +280
°
C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. These are stress ratings only; functional operation of
the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
TIMING PARAMETERS
GENERAL NOTES
Use the exact timing information given. Do not attempt to
derive parameters from the addition or subtraction of others.
While addition or subtraction would yield meaningful results for
an individual device, the values given in this data sheet reflect
statistical variations and worst cases. Consequently, you cannot
meaningfully add up parameters to derive longer times.
TIMING NOTES
Switching characteristics specify how the processor changes its
signals. You have no control over this timing—circuitry external
to the processor must be designed for compatibility with these
signal characteristics. Switching characteristics tell you what the
processor will do in a given circumstance. You can also use
switching characteristics to ensure that any timing requirement
of a device connected to the processor (such as memory) is
satisfied.
Timing requirements apply to signals that are controlled by
circuitry external to the processor, such as the data input for a
read operation. Timing requirements guarantee that the proces-
sor operates correctly with other devices.
MEMORY TIMING SPECIFICATIONS
The table below shows common memory device specifications
and the corresponding ADSP-21mod870 timing parameter.
ADSP-
21mod870
Timing
Parameter
Memory
Device
Specification
Timing
Parameter
Definition
Address Setup to
Write Start
Address Setup to
Write End
Address Hold Time
t
ASW
A0–A13,
xMS
Setup
before
WR
Low
A0–A13,
xMS
Setup
before
WR
Deasserted
A0–A13,
xMS
Hold
before
WR
Low
Data Setup before
WR
High
Data Hold after
WR
High
RD
Low to Data Valid
A0–A13,
xMS
to Data
Valid
t
AW
t
WRA
Data Setup Time
t
DW
Data Hold Time
OE
to Data Valid
Address Access Time
t
DH
t
RDD
t
AA
Note:
xMS
=
PMS
,
DMS
,
BMS
,
CMS
,
IOMS
.
FREQUENCY DEPENDENCY FOR TIMING
SPECIFICATIONS
t
CK
is defined as 0.5 t
CKI
. The ADSP-21mod870 uses an input
clock with a frequency equal to half the instruction rate: a
26 MHz input clock (which is equivalent to 38 ns) yields a 19 ns
processor cycle (equivalent to 52 MHz). t
CK
values within the
range of 0.5 t
CKI
period should be substituted for all relevant tim-
ing parameters to obtain the specification value.
Example: t
CKH
= 0.5 t
CK
– 7 ns = 0.5 (19 ns) – 7 ns = 2.5 ns
ENVIRONMENTAL CONDITIONS
Ambient Temperature Rating:
T
AMB
=
T
CASE
– (PD
×
θ
CA
)
T
CASE
=
Case Temperature in
°
C
PD
=
Power Dissipation in W
θ
CA
=
Thermal Resistance (Case-to-Ambient)
θ
JA
=
Thermal Resistance (Junction-to-Ambient)
θ
JC
=
Thermal Resistance (Junction-to-Case)
Package
u
JA
50
°
C/W
u
JC
2
°
C/W
u
CA
48
°
C/W
LQFP
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