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| 型號： | ADSP-BF532SBBZ400 |
| 廠商： | ANALOG DEVICES INC |
| 元件分類： | 數字信號處理 |
| 英文描述： | Blackfin Embedded Processor |
| 中文描述： | 16-BIT, 40 MHz, OTHER DSP, PBGA169 |
| 封裝： | ROHS COMPLIANT, PLASTIC, MO-034AAG-2, BGA-169 |
| 文件頁數： | 45/56頁 |
| 文件大小： | 671K |
| 代理商： | ADSP-BF532SBBZ400 |
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ADSP-BF531/ADSP-BF532/ADSP-BF533
Rev. 0
|
Page 45 of 56
|
March 2004
ENVIRONMENTAL CONDITIONS
To determine the junction temperature on the application
printed circuit board use:
where:
T
J
= Junction temperature ( C)
T
CASE
= Case temperature ( C) measured by customer at top
center of package.
Ψ
JT
= From
Table 33
P
D
= Power dissipation (see
Power Dissipation on Page 41
for
the method to calculate P
D
)
Values of
θ
JA
are provided for package comparison and printed
circuit board design considerations.
θ
JA
can be used for a first
order approximation of T
J
by the equation:
where:
T
A
= Ambient temperature ( C)
In
Table 33
, airflow measurements comply with JEDEC stan-
dards JESD51-2 and JESD51-6, and the junction-to-board
measurement complies with JESD51-8. The junction-to-case
measurement complies with MIL-STD-883 (Method 1012.1).
All measurements use a 2S2P JEDEC test board.
Thermal resistance
θ
JA
in
Table 33
is the figure of merit relating
to performance of the package and board in a convective envi-
ronment.
θ
JMA
represents the thermal resistance under two
conditions of airflow.
θ
JB
represents the heat extracted from the
periphery of the board.
Ψ
JT
represents the correlation between
T
J
and T
CASE
. Values of
θ
JB
are provided for package compari-
son and printed circuit board design considerations.
Table 33. Thermal Characteristics for BC-160 Package
Parameter
θ
JA
θ
JMA
θ
JMA
θ
JB
θ
JC
Ψ
JT
Condition
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Not applicable
Not applicable
0 Linear m/s Airflow
Typical
34.1
30.1
28.8
25.55
8.75
0.13
Unit
C/W
C/W
C/W
C/W
C/W
C/W
Table 34. Thermal Characteristics for ST-176-1 Package
Parameter
θ
JA
θ
JMA
θ
JMA
Ψ
JT
Ψ
JT
Ψ
JT
Condition
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Typical
34.9
33.0
32.0
0.50
0.75
1.00
Unit
C/W
C/W
C/W
C/W
C/W
C/W
T
J
T
CASE
Ψ
JT
P
D
×
(
)
+
=
T
J
T
A
θ
JA
P
D
×
(
)
+
=
Table 35. Thermal Characteristics for B-169 Package
Parameter
θ
JA
θ
JMA
θ
JMA
θ
JB
θ
JC
Ψ
JT
Condition
0 Linear m/s Airflow
1 Linear m/s Airflow
2 Linear m/s Airflow
Not applicable
Not applicable
0 Linear m/s Airflow
Typical
28.6
24.6
23.8
21.75
12.7
0.78
Unit
C/W
C/W
C/W
C/W
C/W
C/W
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| ADSP-BF532SBST-DAB | 制造商:Analog Devices 功能描述: |
| ADSP-BF532SBSTZ400 | 功能描述:IC DSP CTLR 16BIT 400MHZ 176LQFP RoHS:是 類別:集成電路 (IC) >> 嵌入式 - DSP（數字式信號處理器） 系列:Blackfin® 標準包裝:40 系列:TMS320DM64x, DaVinci™ 類型:定點 接口:I²C，McASP，McBSP 時鐘速率:400MHz 非易失內存:外部 芯片上RAM:160kB 電壓 - 輸入/輸出:3.30V 電壓 - 核心:1.20V 工作溫度:0°C ~ 90°C 安裝類型:表面貼裝 封裝/外殼:548-BBGA，FCBGA 供應商設備封裝:548-FCBGA（27x27） 包裝:托盤 配用:TMDSDMK642-0E-ND - DEVELPER KIT W/NTSC CAMERA296-23038-ND - DSP STARTER KIT FOR TMS320C6416296-23059-ND - FLASHBURN PORTING KIT296-23058-ND - EVAL MODULE FOR DM642TMDSDMK642-ND - DEVELOPER KIT W/NTSC CAMERA |
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