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| 型號(hào)： | ADV7160 |
| 廠商： | Analog Devices, Inc. |
| 英文描述： | 96-Bit, 220 MHz True-Color Video RAM-DAC(96位,220MHz,真彩色視頻RAM-D/A轉(zhuǎn)換器) |
| 中文描述： | 96位，220 MHz的真彩色視頻RAM - DAC的（96位，220MHz，真彩色視頻RAM的的D / A轉(zhuǎn)換器） |
| 文件頁(yè)數(shù)： | 42/44頁(yè) |
| 文件大?。?/td> | 687K |
| 代理商： | ADV7160 |
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ADV7160/ADV7162
APPENDIX 7
THERMAL AND ENVIRONMENTAL CONSIDERATIONS
The ADV7160/ADV7162 is a very highly integrated monolithic
silicon device. This high level of integration, in such a small
package, inevitably leads to consideration of thermal and envi-
ronmental conditions which the ADV7160/ADV7162 must op-
erate in. Reliability of the device is enhanced by keeping it as
cool as possible. In order to avoid destructive damage to the de-
vice, the absolute maximum junction temperature of 150
°
C
must never be exceeded. Certain applications, depending on
ambient temperature and pixel data rates may require forced air
cooling or external heatsinks. The following data is intended as
a guide in evaluating the operating conditions of a particular ap-
plication so that optimum device and system performance is
achieved.
It should be noted that information on package characteristics
published herein may not be the most up to date at the time of
reading this. Advances in package compounds and manufacture
will inevitably lead to improvements in the thermal data. Please
contact your local sales office for the most up-to-date information.
Power Dissipation
The diagrams show graphs of power dissipation in watts versus
pixel clock frequency for the ADV7160 and ADV7162. When
using the ADV7162 in Bypass Mode, the Pixel Mask Register
should be programmed to 00H to reduce power further.
PIXEL CLOCK FREQUENCY – MHz
2.00
0.50
60
100
140
180
220
1.50
1.25
1.00
0.75
1.75
260
2.25
P
V
AA
= +5V
V
REF
= +1.2V
T
A
= +25
°
C
ADV7160
ADV7162
Note:
The "Worst Case On-Screen Pattern" corresponds
to full-scale transition on each pixel value for
every CLOCK edge (00H, FFH, 00H, ...).
The "Typical On-Screen Pattern" corresponds to
linear changes in tne pixel input (i.e., a Black to White Ramp).
In general, color images tend to approximate this characteristic.
Typical Power Dissipation vs. Pixel Rate
Package Characteristics
The tables of thermal characteristics show typical information
for the ADV7160 (160-Lead Plastic Power QFP) and AD7162
(160-Lead Plastic QFP) using various values of Airflow.
Junction-to-Case (
θ
JC
) Thermal Resistance for this particular
part is:
θ
JC
(AD7160) = 0.4
°
C/W
θ
JC
(AD7162) = 6.7
°
C/W
(Note:
θ
JC
is independent of airflow.)
Heatsinks
The maximum silicon junction temperature should be limited to
100
°
C. Temperatures greater than this will reduce long-term
device reliability. To ensure that the silicon junction tempera-
ture stays within prescribed limits, the addition of an external
heatsink may be necessary. Heatsinks will reduce
θ
JA
as shown
in the Thermal Characteristics vs. Airflow table.
Table A. Thermal Characteristics vs. Airflow–ADV7160*
Air Velocity
(Linear Feet/min
0
(Still Air)
50
100
200
θ
JA
°
C/W
No Heatsink
EG&G D10100-28 Heatsink
Thermalloy 2290 Heatsink
25.5
23
19
23
20
17
21
18
15
19
16
12
*These figures do not include thermal conduction through the package leads
into the PCB. Thermal conduction through the leads can provide up to
10
o
C/W reduction in
θ
JA
.
Table B. Thermal Characteristics vs. Airflow–ADV7162*
Air Velocity
(Linear Feet/min)
0
(Still Air)
50
100
200
θ
JA
°
C/W
No Heatsink
EG&G D10850-40 Heatsink
EG&G D10851-36 Heatsink
37
28
32
32
24
24
30
22
19
28
19
14
*These figures do not include thermal conduction through the package leads
into the PCB. Thermal conduction through the leads can provide up to
5
C/W reduction in
θ
JA
.
Thermal Model
The junction temperature of the device in a specific application
is given by:
T
J
= T
A
+ P
D
(
θ
JC
+
θ
CA
)
or
T
J
= T
A
+ P
D
(
θ
JA
)
where:
T
J
= Junction Temperature of Silicon (
°
C)
T
A
= Ambient Temperature (
°
C)
P
D
= Power Dissipation (W)
θ
JC
= Junction to Case Thermal Resistance (
°
C/W)
θ
CA
= Case to Ambient Thermal Resistance (
°
C/W)
θ
JA
= Junction to Ambient Thermal Resistance (
°
C/W)
Package Enhancements for ADV7160
The standard PQFP package has been enhanced to a
PowerQuad2 package. This supports an improved thermal
performance compared to standard PQFP. In this case, the die
is attached to a heat slug so that the power that is dissipated can
be conducted to the external surface of the package. This pro-
vides a highly efficient path for the transfer of heat to the pack-
age surface. The package configuration also provides and efficient
thermal path from the ADV7160 to the Printed Circuit Board.
(1)
(2)
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| ADV7162 | 96-Bit, 220 MHz True-Color Video RAM-DAC(96位,220MHz,真彩色視頻RAM-D/A轉(zhuǎn)換器) |
| ADV7162KS140 | 96-Bit, 220 MHz True-Color Video RAM-DAC |
| ADV7162KS170 | 96-Bit, 220 MHz True-Color Video RAM-DAC |
| ADV7162KS220 | 96-Bit, 220 MHz True-Color Video RAM-DAC |
| ADV7160KS140 | 96-Bit, 220 MHz True-Color Video RAM-DAC |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| ADV7160KS140 | 制造商:Analog Devices 功能描述: 制造商:Rochester Electronics LLC 功能描述:220 MHZ VIDEO RAM DAC I.C. - Bulk |
| ADV7160KS170 | 制造商:Analog Devices 功能描述:DAC 3-CH Segment 10-bit 160-Pin MQFP 制造商:Rochester Electronics LLC 功能描述:220 MHZ VIDEO RAM DAC I.C. - Bulk |
| ADV7160KS220 | 制造商:Analog Devices 功能描述: 制造商:Rochester Electronics LLC 功能描述: |
| ADV7162 | 制造商:AD 制造商全稱:Analog Devices 功能描述:96-Bit, 220 MHz True-Color Video RAM-DAC |
| ADV7162KS140 | 制造商:Rochester Electronics LLC 功能描述: 制造商:Analog Devices 功能描述: |
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