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參數資料
| 型號： | AE312RAH10NJSP |
| 廠商： | COILCRAFT INC |
| 元件分類： | 通用定值電感 |
| 英文描述： | 1 ELEMENT, 0.01 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD |
| 封裝： | CHIP, 0603 |
| 文件頁數： | 1/2頁 |
| 文件大小： | 208K |
| 代理商： | AE312RAH10NJSP |
1102 Silver Lake Road
Cary IL 60013
Phone
Fax
800-981-0363
847-639-1508
E-mail
Web
cp@coilcraft.com
www.coilcraft-cps.com
Coilcraft, Inc. 2009
These parts are preproduction products for electrical evaluation only.
Specification subject to change without notice.
Aerospace Grade Chip Inductors AE312RAH
0603 CHIP INDUCTORS
Document AE431-1
Revised 06/02/09
A
B
overall
E
terminal
F
D
G
C
H
Recommended
Land Pattern
Terminal wraparound:
approx 0.007/0,18 both ends
ABCD
E
0.063 ±0.008
0.031 ±0.008
0.012 ±0.004
0.031 ±0.006
1,6 ±0,2
0,8 ±0,2
0,3 ±0,1
0,8 ±0,15
FG
H
0.027
0.075
0.035
inches
0,7
1,9
0,9
mm
Typical Q vs Frequency
1
10
100
1000
10000
Frequency (MHz)
0
100
90
80
70
60
50
40
30
20
10
110
120
Q
F
actor
20 nH
3.6 nH
47 nH
100 nH
Typical L vs Frequency
1
10
100
1000
10000
Frequency (MHz)
0
100
90
80
70
60
50
40
30
20
10
110
120
Inductance
(nH)
20 nH
3.6 nH
47 nH
100 nH
This robust version of Coilcraft’s standard 0603ME series
features high temperature materials that pass NASA low
outgassing specifications and allow operation in ambient
temperatures up to 155°C. The leach-resistant base
metalization with tin-lead (Sn-Pb) terminations ensures
the best possible board adhesion.
All dimensions are without solder applied to the terminations. For
maximum dimensions with solder, add 0.006 inches / 0,152 mm.
■ High SRF, excellent Q values and low DCR
■ 45 inductance values from 2.2 nH to 470 nH, some not
found in any of our other 0603 series
■ Comparable with other industry standards
Irms Derating
-40
-55
-20
0
20
40
60
80
100
160
140
120
Ambient temperature (°C)
P
e
rcent
of
rated
rmsI
120
110
100
90
80
70
60
50
40
30
20
10
0
25°C
Core material Ceramic
Terminations Tin-lead (63/37) over silver-platinum-glass frit
Ambient temperature –55°C to +125°C with
Imax current, +125°C
to +155°C with derated current
Storage temperature Component: –55°C to +155°C.
Packaging: –55°C to +80°C
Resistance to soldering heat Max three 40 second reflows at
+260°C, parts cooled to room temperature between cycles
Temperature Coefficient of Inductance (TCL) +25 to +155 ppm/°C
Moisture Sensitivity Level (MSL) 1 (unlimited floor life at <30°C /
85% relative humidity)
Enhanced crush-resistant packaging 2000 per 7
″ reel. Paper
tape: 8 mm wide, 1 mm thick, 4 mm pocket spacing
Suggested
Land Pattern
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