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參數資料
型號: AFM04P2-000
元件分類: 小信號晶體管
英文描述: KA BAND, GaAs, N-CHANNEL, RF SMALL SIGNAL, MESFET
封裝: DIE-2
文件頁數: 1/3頁
文件大小: 43K
代理商: AFM04P2-000
Alpha Industries, Inc. [781] 935-5150
Fax [617] 824-4579 Email sales@alphaind.com www.alphaind.com
1
Specifications subject to change without notice. 12/99A
Ka Band Power GaAs MESFET Chip
Features
I 21 dBm Output Power @ 18 GHz
I High Associated Gain, 9 dB @ 18 GHz
I High Power Added Efficiency, 25%
I Broadband Operation, DC–40 GHz
I 0.25 m Ti/Pd/Au Gates
I Passivated Surface
I Through-Substrate Via Hole Grounding
Description
The AFM04P2-000 is a high performance power GaAs
MESFET chip having a gate length of 0.25
m and a
total gate periphery of 400
m. The device has
excellent gain and power performance through 40 GHz,
making it suitable for a wide range of commercial and
military applications in oscillator and amplifier circuits. It
employs Ti/Pd/Au gate metallization and surface
passivation to ensure a rugged, reliable part. Through-
substrate via holes are incorporated into the chip to
facilitate low inductance grounding of the source for
improved high frequency and high gain performance.
AFM04P2-000
Parameter
Test Conditions
Min.
Typ.
Max.
Unit
Saturated Drain Current (IDSS)
VDS = 2 V, VGS = 0 V
90.0
140.0
190.0
mA
Transconductance (gm)
60.0
80.0
mS
Pinch-off Voltage (VP)
VDS = 5 V, IDS = 1 mA
1.0
3.0
5.0
-V
Gate to Drain
IGD = -400 A
8.0
12.0
-V
Breakdown Voltage (Vbgd)
Output Power at 1 dB
21.0
dBm
Compression (P1 dB)
Gain at 1 dB Compression (G1 dB)
VDS = 5 V, IDS = 70 mA, F = 18 GHz
9.0
dB
Power Added Efficiency (
ηadd)
25.0
%
Output Power at 1 dB
20.0
dBm
Compression (P1 dB)
Gain at 1 dB Compression (G1 dB)
VDS = 5 V, IDS = 70 mA, F = 30 GHz
5.0
dB
Power Added Efficiency (
ηadd)
15.0
%
Thermal Resistance (
ΘJC)
TBASE = 25°C
250.0
°C/W
Electrical Specifications at 25°C
0.395
mm
0.327 mm
Drain
Gate
0.655 mm
0.110 mm
Characteristic
Value
Drain to Source Voltage (VDS)
6 V
Gate to Source Voltage (VGS)
-4 V
Drain Current (IDS)
IDSS
Gate Current (IGS)
1 mA
Total Power Dissipation (PT)
700 mW
Storage Temperature (TST)
-65 to +150°C
Channel Temperature (TCH)
175°C
Absolute Maximum Ratings
Chip thickness = 0.1 mm.
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