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參數資料
| 型號： | AG303-86PCB |
| 廠商： | Electronic Theatre Controls, Inc. |
| 元件分類： | 圓形連接器 |
| 英文描述： | Circular Connector; No. of Contacts:55; Series:MS27468; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:17; Circular Contact Gender:Socket; Circular Shell Style:Jam Nut Receptacle; Insert Arrangement:17-35 RoHS Compliant: No |
| 中文描述： | InGaP HBT增益模塊 |
| 文件頁數： | 1/3頁 |
| 文件大小： | 216K |
| 代理商： | AG303-86PCB |
This document contains information on a new product.
Specifications and information are subject to change without notice
WJ Communications, Inc
Phone 1-800-WJ1-4401
FAX: 408-577-6620
e-mail: sales@wj.com
Web site: www.wj.com
June 2002
The Communications Edge
TM
Preliminary Product Information
AG303
InGaP HBT Gain Block
Functional Diagram
Product Features
DC - 5000MHz
+13 dBm P1dB at 900MHz
+27 dBm OIP3 at 900MHz
20.5 dB Gain at 900MHz
Single Voltage Supply
SOT-363 or SOT-86 SMT
Package
Internally matched to 50
Product Description
The AG303 is a general-purpose buffer amplifier that offers high
dynamic range in a low-cost surface-mount package. At 900 MHz,
the AG303 typically provides 20.5 dB of gain, +27 dBm Output
IP3, and +13 dBm P1dB. The device combines dependable
performance with consistent quality to maintain MTBF values
exceeding 100 years at mounting temperatures of +85
°
C and is
housed in a SOT-363 & SOT-86 industry standard SMT packages.
The AG303 consists of Darlington pair amplifiers using the high
reliability InGaP/GaAs HBT technology process technology and
only requires DC-blocking capacitors, a bias resistor, and an
inductive RF choke for operation.
The broadband MMIC amplifier can be directly applied to various
current and next generation wireless technologies such as GPRS,
GSM, CDMA, W-CDMA, and UMTS. In addition, the AG303
will work for other various applications within the DC to 5 GHz
frequency range such as CATV and fixed wireless.
RF IN
GND
RF OUT
GND
GND
GND
AG303-63
Typical Parameters
Parameter
1
Units
Typical
Frequency
S21
S11
S22
Output P1dB
Output IP3
Noise Figure
Supply Voltage
Device Current
1. Data represents typical performance in an application board with
T = 25oC, V
s
= +5 V, and R
bias
= 30
in a 50
system.
Ordering Information
MHz
dB
dB
dB
dBm
dBm
dB
V
mA
900
20.5
-20
-20
+13
+27
3.6
5
35
1900
19
-15
-20
+12
+25
3.6
5
35
Part No.
AG303-63
Description
InGaP HBT Gain Block
SOT-363 Style Package
(Available in Tape & Reel)
InGaP HBT Gain Block
SOT-86 Style Package
(Available in Tape & Reel)
Fully Assembled Application Board
Fully Assembled Application Board
AG303-86
AG303-63PCB
AG303-86PCB
Specifications
Parameters
1
Units
Min
Typ
Max
Frequency Range
S21 - Gain
S11 - Input Return Loss
S22 - Output Return Loss
Output P1dB
Output IP3
Noise Figure
Device Voltage
Device Current
Test conditions unless otherwise noted
1. T = 25oC, Supply Voltage = +5 V, R
= 30
, Frequency = 900MHz, 50
System.
2. 3OIP measured with two tones at an output power of -5 dBm/tone separated by 10MHz. The
suppression on the largest IM3 product is used to calculate the 3OIP using a 2:1 rule.
Absolute Maximum Ratings
MHz
dB
dB
dB
dBm
dBm
dB
V
mA
DC-5000
20.5
-15
-15
+13
+27
3.6
4.0
35
Parameters
Operating Case Temperature
Storage Temperature
Operation of this device above any of there parameters may cause permanent damage
Application Circuit
Rating
-40 to +85
°
C
-40 to +125
°
C
RF in
GND
RF OUT
GND
AG33
AG303-86
AG303
C1
Blocking
Capacitor
RF OUT
L1
RF
Choke
V
S
= +5 V
I
S
= 35 mA
C3
Bypass Capacitor
C2
Blocking
Capacitor
R1
30
RF IN
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PDF描述 |
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| AG403-86G | Circular Connector; No. of Contacts:6; Series:MS27468; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:17; Circular Contact Gender:Pin; Circular Shell Style:Jam Nut Receptacle; Insert Arrangement:17-6 RoHS Compliant: No |
| AG403 | InGaP HBT Gain Block |
| AG403-86 | InGaP HBT Gain Block |
| AG403-86PCB | InGaP HBT Gain Block |
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相關代理商/技術參數 |
參數描述 |
|---|---|
| AG303-86-RFID | 制造商:WJCI 制造商全稱:WJCI 功能描述:InGaP HBT Gain Block |
| AG303-86TRG | 制造商:TriQuint Semiconductor 功能描述:GAIN BLOCK |
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| AG30P-12 | 功能描述:SINGLE O/P, DC-HV DC PCB MOUNT, 制造商:xp power 系列:XP EMCO - AG 包裝:盒 零件狀態:有效 類型:高電壓 - 隔離模塊 輸出數:1 電壓 - 輸入（最小值）:0.7V 電壓 - 輸入（最大值）:12V 電壓 - 輸出 1:3000V 電壓 - 輸出 2:- 電壓 - 輸出 3:- 電流 - 輸出（最大值）:330μA 功率（W） - 制造系列:1W 電壓 - 隔離:500V 應用:ITE（商業） 特性:SCP 安裝類型:表面貼裝 封裝/外殼:5-SMD 模塊 大小/尺寸:1.13" 長 x 0.45" 寬 x 0.25" 高（28.7mm x 11.4mm x 6.4mm） 工作溫度:-25°C ~ 75°C 效率:- 功率（W） - 最大值:1W 標準包裝:1 |
| AG30P-5 | 功能描述:SINGLE O/P, DC-HV DC PCB MOUNT, 制造商:xp power 系列:XP EMCO - AG 包裝:盒 零件狀態:有效 類型:高電壓 - 隔離模塊 輸出數:1 電壓 - 輸入（最小值）:0.7V 電壓 - 輸入（最大值）:5V 電壓 - 輸出 1:3000V 電壓 - 輸出 2:- 電壓 - 輸出 3:- 電流 - 輸出（最大值）:330μA 功率（W） - 制造系列:1W 電壓 - 隔離:500V 應用:ITE（商業） 特性:SCP 安裝類型:表面貼裝 封裝/外殼:5-SMD 模塊 大小/尺寸:1.13" 長 x 0.45" 寬 x 0.25" 高（28.7mm x 11.4mm x 6.4mm） 工作溫度:-25°C ~ 75°C 效率:- 功率（W） - 最大值:1W 標準包裝:1 |
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