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參數(shù)資料
型號(hào): AM45DL3208GT70IS
廠商: ADVANCED MICRO DEVICES INC
元件分類: 存儲(chǔ)器
英文描述: Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
中文描述: SPECIALTY MEMORY CIRCUIT, PBGA73
封裝: 8 X 11.60 MM, FBGA-73
文件頁(yè)數(shù): 1/66頁(yè)
文件大小: 1196K
代理商: AM45DL3208GT70IS
September 2003
The following document specifies Spansion memory products that are now offered by both Advanced
Micro Devices and Fujitsu. Although the document is marked with the name of the company that orig-
inally developed the specification, these products will be offered to customers of both AMD and
Fujitsu.
Continuity of Specifications
There is no change to this datasheet as a result of offering the device as a Spansion product. Any
changes that have been made are the result of normal datasheet improvement and are noted in the
document revision summary, where supported. Future routine revisions will occur when appropriate,
and changes will be noted in a revision summary.
Continuity of Ordering Part Numbers
AMD and Fujitsu continue to support existing part numbers beginning with “Am” and “MBM”. To order
these products, please use only the Ordering Part Numbers listed in this document.
For More Information
Please contact your local AMD or Fujitsu sales office for additional information about Spansion
memory solutions.
Am45DL3208G
Data Sheet
Publication Number
26460
Revision
B
Amendment
+1
Issue Date
March 12, 2004
相關(guān)PDF資料
PDF描述
AM45DL3208GT70IT Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM45DL3208GT85IS Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM45DL3208GT85IT Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM4701 Dual 512 x 8 Bidirectional Parity Generator/Checker, Bypass Mode, Programmable AE/AF Flags
AM4701-35 Dual 512 x 8 Bidirectional Parity Generator/Checker, Bypass Mode, Programmable AE/AF Flags
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
AM45DL3208GT70IT 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM45DL3208GT85IS 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM45DL3208GT85IT 制造商:AMD 制造商全稱:Advanced Micro Devices 功能描述:Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM45DL32X8G 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Am45DL32x8G - Stacked Multi-Chip Package (MCP) Flash Memory and SRAM
AM45DL6408G 制造商:未知廠家 制造商全稱:未知廠家 功能描述:64 Mbit (8 M x 8-Bit/4 M x 16-Bit) CMOS and 8 Megabit (1 M x 8-Bit/512 K x 16-Bit) (Preliminary)
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